* enlarge the hole size on thermal pad
* MH-54 Changed diameter of via on the thermal relief to 0.6mm, updated the version number
* MH-54 Generate and update the project outputs
* enlarge hole size for footprint IC HSD DUAL-CHANNEL TSOP65P640X120_HS-17N
* MH-54 BMS Carrier Organized the output files
* mh-54 tent the via by C21, fix 3D models' offset and update few supplier link in library
* mh-54 update the fabrication files
* fix the overlay of label FAN4 and P12
Co-authored-by: Liam Hawkins <45611744+lghawkin@users.noreply.github.com>
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