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af68991d90
* enlarge the hole size on thermal pad * MH-54 Changed diameter of via on the thermal relief to 0.6mm, updated the version number * MH-54 Generate and update the project outputs * enlarge hole size for footprint IC HSD DUAL-CHANNEL TSOP65P640X120_HS-17N * MH-54 BMS Carrier Organized the output files * mh-54 tent the via by C21, fix 3D models' offset and update few supplier link in library * mh-54 update the fabrication files * fix the overlay of label FAN4 and P12 Co-authored-by: Liam Hawkins <45611744+lghawkin@users.noreply.github.com> |
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Project Outputs for BMS_Carrier_Board | ||
AFE_isoSPI_Interface.Harness | ||
Block Diagram.SchDoc | ||
BMS Carrier - AFE Interface.Harness | ||
BMS Carrier - AFE Interface.SchDoc | ||
BMS Carrier - Battery Relay Controls.SchDoc | ||
BMS Carrier - Connectors.SchDoc | ||
BMS Carrier - Current Sense Interface.Harness | ||
BMS Carrier - Current Sense Interface.SchDoc | ||
BMS Carrier - Fan Controls.SchDoc | ||
BMS Carrier - Firmware Contactor Control.SchDoc | ||
BMS Carrier - Temperature Sense Interface.SchDoc | ||
BMS_Carrier_Board.PcbDoc | ||
BMS_Carrier_Board.PrjPcb | ||
BMS_Carrier_Board.PrjPcbVariants | ||
Controller_Board_Interface.Harness | ||
Controller_Board_Interface.SchDoc | ||
Copy of BMS_Carrier_Board.PcbDoc | ||
CurrentSense_isoSPI_Interface.Harness | ||
Elecrow.OutJob |