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af68991d90
* enlarge the hole size on thermal pad * MH-54 Changed diameter of via on the thermal relief to 0.6mm, updated the version number * MH-54 Generate and update the project outputs * enlarge hole size for footprint IC HSD DUAL-CHANNEL TSOP65P640X120_HS-17N * MH-54 BMS Carrier Organized the output files * mh-54 tent the via by C21, fix 3D models' offset and update few supplier link in library * mh-54 update the fabrication files * fix the overlay of label FAN4 and P12 Co-authored-by: Liam Hawkins <45611744+lghawkin@users.noreply.github.com> |
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| .. | ||
| BMS Carrier Rev 1.0 | ||
| BMS Carrier Rev 1.1 | ||
| Fabrication Files Rev 1.1 | ||
| BMS_Carrier_Board_1.1.PDF | ||
| BMS_Carrier_Board_1.1.step | ||
| BMS_Carrier_Board_1.1.xlsx | ||
| Status Report.Txt | ||