Chenao Yuan af68991d90 Mh 54 bms carrier board (#108) ... * enlarge the hole size on thermal pad * MH-54 Changed diameter of via on the thermal relief to 0.6mm, updated the version number * MH-54 Generate and update the project outputs * enlarge hole size for footprint IC HSD DUAL-CHANNEL TSOP65P640X120_HS-17N * MH-54 BMS Carrier Organized the output files * mh-54 tent the via by C21, fix 3D models' offset and update few supplier link in library * mh-54 update the fabrication files * fix the overlay of label FAN4 and P12 Co-authored-by: Liam Hawkins <45611744+lghawkin@users.noreply.github.com>		2020-02-05 20:31:40 -05:00
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Fabrication Files	Hw 231 dcdc rev 2 (#96)	2019-09-28 17:57:20 -04:00
lockfile.lck	Mh 54 bms carrier board (#108)	2020-02-05 20:31:40 -05:00
MSXIV_DC-DC_Converter_2.0.PDF	Hw 231 dcdc rev 2 (#96)	2019-09-28 17:57:20 -04:00
MSXIV_DC-DC_Converter_2.0.step	Hw 231 dcdc rev 2 (#96)	2019-09-28 17:57:20 -04:00
MSXIV_DC-DC_Converter_2.0.xls	Hw 231 dcdc rev 2 (#96)	2019-09-28 17:57:20 -04:00
MSXIV_DC-DC_Converter.xlsx	Hw 231 dcdc rev 2 (#96)	2019-09-28 17:57:20 -04:00
Status Report.Txt	Hw 231 dcdc rev 2 (#96)	2019-09-28 17:57:20 -04:00