Chenao Yuan af68991d90

Mh 54 bms carrier board (#108) ...

* enlarge the hole size on thermal pad

* MH-54 Changed diameter of via on the thermal relief to 0.6mm, updated the version number

* MH-54 Generate and update the project outputs

* enlarge hole size for footprint IC HSD DUAL-CHANNEL TSOP65P640X120_HS-17N

* MH-54 BMS Carrier Organized the output files

* mh-54 tent the via by C21, fix 3D models' offset and update few supplier link in library

* mh-54 update the fabrication files

* fix the overlay of label FAN4 and P12

Co-authored-by: Liam Hawkins <45611744+lghawkin@users.noreply.github.com>

2020-02-05 20:31:40 -05:00

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