Archimajor/.allspice/pull_request_template.md

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AllSpice Pull Request Template	Optional description

This short description prepends any pull request. It is fully markdown compatible. See markdown guide for examples of what you can do!

Resolved Issues

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Description

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Design Review Checklist

Process

• Schematic and PCB file names follow standard
• Export necessary review files (3D model, BOM, etc.)
• Update relevant system architecture documents
• Update project README page
• Simulations uploaded and outputs explained

System

• Power
  • Sufficient power supplied from upstream source
  • Supply rated for necessary country specifications
  • Estimated total worst-case power supply draw
• Connectors
  • I/Os are specified
  • Sufficient Current and Voltage rating
  • Mating connectors have matching pinout
  • Same contact material specified for mating connectors
• Testing
  • Test procedure written
• Environmental
  • Specified min/max operating temperature
  • Specified min/max storage temperature
  • Specified min/max humidity
• ROHS compliance requirement review

Components

• Unpopulated components are denoted DNI
• Components meet environmental specifications
• All components have quantity, reference designator and description
• Suggested and alternate manufacturers listed
• Price and stock checked for each component
• Component derating
  • Voltage
  • Current
  • Power at worst-case operating temperature
  • Temperature at worst-case power

Schematics

• Document
  • Dot on each connection
  • No four-point connections
  • Title block completed for each sheet
  • All components have reference designators and values
  • Multi-part components don't have unplaced symbols
  • Page title present and consistent on all pages if not in title block
  • Symbols identify open collector/drain pins and internal pulled up/down pins
  • Pin names and attributes on symbols with multi-function pins should match actual design usage (I/O/Bi, Name)
  • Components follow preferred reference designator pattern
• External I/O
  • Filtered for EMI
  • Protected against electrostatic discharge (ESD)
  • Unused inputs terminated
• Microcontrollers / ICs
  • Predictable or controlled power-up state
    • Reset filtered
  • Sufficient bypass capacitance
  • Oscillators checked for reliable startup
  • Pullups on open-collector pins
  • Logic-low and logic-high voltage levels checked
  • No-connect pins labeled NC
  • Clock lines with series termination and parallel termination component locations present even if not populated; zero ohm resistor for series, unpopulated parts for parallel termination
  • Check for input voltages applied with power off and CMOS latchup possibilities
  • Check the data sheet errata and apnotes for weird IC behaviors
• Busses
  • UART/USART TX->RX and RX<-TX
  • I2C SDA and SCL pullup with appropriate value per capacitance
  • Setup, hold, access times for data and address busses
• Analog
  • Sufficient power rails for analog circuits
  • Amplifiers checked for stability
  • Consider signal rate-of-rise and fall for noise radiation
• General
  • Sufficient bulk capacitance calculated
  • Polarized components checked
  • Electrolytic/tantalum capacitors checked for no reverse voltage
  • Electrolytic/tantalum capacitors temperature/voltage derating sufficient for MTBF
  • Sufficient capacitance on low dropout voltage regulators
  • Sufficient time delays and slew rates for comparators
  • Sufficient common mode input voltage rating on opamps
  • Check pin numbers of all custom-generated parts
  • Check reverse base-emitter current/voltage on bipolar transistors
  • Power nets use preferred and consistent naming (ex. no 3.3V vs +3.3V)
  • Debug resources added by design (leds, serial ports, etc.) even if unpopulated by default

PCB

• Manufacturing
  • PCB manufacturing requirements noted on fab layer
    • Plating specified
      • Plating material
      • Plating thickness
    • Layer stack-up specified
    • Minimum trace/space specified
    • Minimum hole size specified
    • PCB color specified
    • Silkscreen color specified
    • Controlled impedance specified
    • Blind or buried vias specified
    • Panelization specified
      • External routing specified (ex. v-groove vs route)
    • Drill table generated
    • All specifications exceed manufacturing tolerance
  • Space between power planes minimized
  • Solder paste openings proper size
  • Fiducials placed if necessary
• Footprints
  • Pin 1 marked in a consistent manner
  • Component polarity marked
    • Diodes, LEDs
    • Electrolytic, tantalum capacitors
    • Keyed components like connectors
  • Footprint dimensions cross-checked with datasheet recommendation
  • Sufficient thermal pads on high-power components or nets
• Placement
  • Jumpers accessible
  • Debug connectors accessible
  • Filter resistors closer to source
  • Termination resistors close to target
  • Small loop path on switch-mode power supplies
  • Bypass capacitors close to ICs
  • Bypass capacitors close to connectors
  • Drivers / receivers close to connectors
  • SMT components on top side, through-hole components on bottom side if possible
• Clearance
  • Keep-out areas honored
    • Around mounting holes
    • For programming tools
    • For assembly tools (wrenches, screwdrivers etc.)
    • For connectors
  • Trace-to-trace clearance based upon voltage rating
  • Component size based upon voltage rating
  • Keep components away from board edge
• Mechanical
  • CAD file uploaded
  • Clearance above connectors
  • Clearance below through-hole components
  • Enough space for the minimum bending radius of the wire harness
  • Mounting holes electrically isolated if necessary
    • Mounting holes have via stitching
  • Hole diameters leave margin for plating
  • Board outline defined
  • Mechanical enclosure defined
  • Internal corners are rounded and can be milled
• Electrical
  • All traces are routed
  • Analog and digital commons joined at only one point
  • ERC passes
  • Isolation barriers are large enough
• Signal integrity
  • Gaps in ground planes checked and minimized
  • High-speed signals avoid gaps in ground planes
  • Stubs minimized for high-speed signals
  • Differential pair spacing based upon impedance matching
  • Transmission lines terminated with an appropriate impedance
  • Crystal connections kept short
  • Guard ring around crystals
  • Traces avoided under sensitive components
  • Traces avoided under noisy components
  • Via fencing of sensitive RF transission lines done with the proper via spacing (< 1/20 lambda)
  • Option for a shielding can over sensitive circuitry e.g. RF?
• Copper pour
  • All planes have been poured
  • Planes and pours checked for high-impedance paths
  • No pour between adjacent pins on ICs
• Traces
  • Trace-pad connections sufficiently obtuse (angle 90 deg or more)
  • Trace widths sufficient for the current draw and max heating
  • No connections between adjacent pins on ICs
  • Vias for internal power traces sufficiently large
  • Mitered bends or soft curves (r > 3 trace width) for impedance sensitive traces
• Thermal
  • Temperature sensitive components placed away from hot components
  • Thermal vias in thermal pads
• Testing
  • Test points on PCBs for critical circuits, hard to reach nets
  • Ground connection points close to analog test points
• Silk screen
  • Notes and documentation
    • Updated revision number
    • Updated date
    • Blank space designated for a serial / assembly number
  • No silk screen over pads / vias
  • Text is readable from at most two directions
  • Silk screen size / font will legible after printing
  • Connector pin-outs labeled
  • Fuse size and type marked on PCB
  • Functional groups marked
  • Functionality labeled
    • Test points
    • LEDs
    • Buttons
    • Connectors/terminals
    • Jumpers/fuses