ThunderScope/Hardware/KiCad/Thunderscope_Rev5/Fabrication Outputs/Thunderscope_Rev5-job.gbrjob

{
  "Header": {
    "GenerationSoftware": {
      "Vendor": "KiCad",
      "Application": "Pcbnew",
      "Version": "9.0.0"
    },
    "CreationDate": "2025-04-15T16:43:57-04:00"
  },
  "GeneralSpecs": {
    "ProjectId": {
      "Name": "Thunderscope_Rev5",
      "GUID": "5468756e-6465-4727-9363-6f70655f5265",
      "Revision": "rev?"
    },
    "Size": {
      "X": 122.55,
      "Y": 103.55
    },
    "LayerNumber": 6,
    "BoardThickness": 1.5354,
    "Finish": "None",
    "ImpedanceControlled": true
  },
  "DesignRules": [
    {
      "Layers": "Outer",
      "PadToPad": 0.127,
      "PadToTrack": 0.127,
      "TrackToTrack": -0.0,
      "MinLineWidth": 0.127,
      "TrackToRegion": 0.127,
      "RegionToRegion": 0.127
    },
    {
      "Layers": "Inner",
      "PadToPad": 0.127,
      "PadToTrack": 0.127,
      "TrackToTrack": -0.0,
      "MinLineWidth": 0.127,
      "TrackToRegion": 0.127,
      "RegionToRegion": 0.127
    }
  ],
  "FilesAttributes": [
    {
      "Path": "Thunderscope_Rev5-Top Layer.gbr",
      "FileFunction": "Copper,L1,Top",
      "FilePolarity": "Positive"
    },
    {
      "Path": "Thunderscope_Rev5-Int1 (GND).gbr",
      "FileFunction": "Copper,L5,Inr",
      "FilePolarity": "Positive"
    },
    {
      "Path": "Thunderscope_Rev5-Int2 (Sign).gbr",
      "FileFunction": "Copper,L7,Inr",
      "FilePolarity": "Positive"
    },
    {
      "Path": "Thunderscope_Rev5-Int3 (Sign).gbr",
      "FileFunction": "Copper,L9,Inr",
      "FilePolarity": "Positive"
    },
    {
      "Path": "Thunderscope_Rev5-Int4 (GND).gbr",
      "FileFunction": "Copper,L11,Inr",
      "FilePolarity": "Positive"
    },
    {
      "Path": "Thunderscope_Rev5-Bottom Layer.gbr",
      "FileFunction": "Copper,L6,Bot",
      "FilePolarity": "Positive"
    },
    {
      "Path": "Thunderscope_Rev5-TopPaste.gbr",
      "FileFunction": "SolderPaste,Top",
      "FilePolarity": "Positive"
    },
    {
      "Path": "Thunderscope_Rev5-BottomPaste.gbr",
      "FileFunction": "SolderPaste,Bot",
      "FilePolarity": "Positive"
    },
    {
      "Path": "Thunderscope_Rev5-Top Overlay.gbr",
      "FileFunction": "Legend,Top",
      "FilePolarity": "Positive"
    },
    {
      "Path": "Thunderscope_Rev5-Bottom Overlay.gbr",
      "FileFunction": "Legend,Bot",
      "FilePolarity": "Positive"
    },
    {
      "Path": "Thunderscope_Rev5-Top Solder.gbr",
      "FileFunction": "SolderMask,Top",
      "FilePolarity": "Negative"
    },
    {
      "Path": "Thunderscope_Rev5-Bottom Solder.gbr",
      "FileFunction": "SolderMask,Bot",
      "FilePolarity": "Negative"
    },
    {
      "Path": "Thunderscope_Rev5-Board Outline.gbr",
      "FileFunction": "Profile",
      "FilePolarity": "Positive"
    }
  ],
  "MaterialStackup": [
    {
      "Type": "Legend",
      "Name": "Top Silk Screen"
    },
    {
      "Type": "SolderPaste",
      "Name": "Top Solder Paste"
    },
    {
      "Type": "SolderMask",
      "Thickness": 0.0152,
      "Name": "Top Solder Mask"
    },
    {
      "Type": "Copper",
      "Thickness": 0.0432,
      "Name": "Top Layer"
    },
    {
      "Type": "Dielectric",
      "Thickness": 0.1107,
      "Material": "FR4",
      "DielectricConstant": "3.23",
      "LossTangent": "0.02",
      "Name": "Top Layer/Int1 (GND)",
      "Notes": "Type: dielectric layer 1 (from Top Layer to Int1 (GND))"
    },
    {
      "Type": "Copper",
      "Thickness": 0.0175,
      "Name": "Int1 (GND)"
    },
    {
      "Type": "Dielectric",
      "Thickness": 0.1016,
      "Material": "FR4",
      "DielectricConstant": "3.66",
      "LossTangent": "0.02",
      "Name": "Int1 (GND)/Int2 (Sign)",
      "Notes": "Type: dielectric layer 2 (from Int1 (GND) to Int2 (Sign))"
    },
    {
      "Type": "Copper",
      "Thickness": 0.0175,
      "Name": "Int2 (Sign)"
    },
    {
      "Type": "Dielectric",
      "Thickness": 0.9256,
      "Material": "FR4",
      "DielectricConstant": "4.5",
      "LossTangent": "0.02",
      "Name": "Int2 (Sign)/Int3 (Sign)",
      "Notes": "Type: dielectric layer 3 (from Int2 (Sign) to Int3 (Sign))"
    },
    {
      "Type": "Copper",
      "Thickness": 0.0175,
      "Name": "Int3 (Sign)"
    },
    {
      "Type": "Dielectric",
      "Thickness": 0.1107,
      "Material": "FR4",
      "DielectricConstant": "3.66",
      "LossTangent": "0.02",
      "Name": "Int3 (Sign)/Int4 (GND)",
      "Notes": "Type: dielectric layer 4 (from Int3 (Sign) to Int4 (GND))"
    },
    {
      "Type": "Copper",
      "Thickness": 0.0175,
      "Name": "Int4 (GND)"
    },
    {
      "Type": "Dielectric",
      "Thickness": 0.1,
      "Material": "FR4",
      "DielectricConstant": "3.23",
      "LossTangent": "0.02",
      "Name": "Int4 (GND)/Bottom Layer",
      "Notes": "Type: dielectric layer 5 (from Int4 (GND) to Bottom Layer)"
    },
    {
      "Type": "Copper",
      "Thickness": 0.0432,
      "Name": "Bottom Layer"
    },
    {
      "Type": "SolderMask",
      "Thickness": 0.0152,
      "Name": "Bottom Solder Mask"
    },
    {
      "Type": "SolderPaste",
      "Name": "Bottom Solder Paste"
    },
    {
      "Type": "Legend",
      "Name": "Bottom Silk Screen"
    }
  ]
}