incutec-KiCad-Library/ALTERNATES.md

Alternates

Second sources for OpenDrone parts, grouped by the only thing that makes a swap possible: one land pattern, one pinout, one function. A part listed here fits the copper. Whether it fits the board is the second half of each section, and that half disqualifies most candidates.

Nothing here is fitted. The fitted part is named at the top of each class and is the only one that has been through an assembly run. Promoting an alternate is a board change: datasheet read, stencil check, bench run, in that order.

Verified means the pinout or the parameter was read out of the manufacturer datasheet. Screened means it came from a distributor parametric field and nobody has opened the datasheet. Do not order against a screened row.

Judge a package by its measured body, not its name. Every vendor names its own eight-lead power package and the names do not map onto each other: Toshiba SOP Advance, Vishay PowerPAK SO-8, Infineon SuperSO8, Nexperia LFPAK56 and a generic PDFN5x6 are all the same size class. Whether one lands on our copper is arithmetic on the datasheet drawing, not a question about the name, and the answer for the 5x6 class is in that section.

MOSFET stock and price are JLCPCB parts API, checked 2026-08-29, at the 1000 break unless the row says otherwise. Gate driver rows are LCSC at 2026-08-27. They move.

Power MOSFET, DFN 5x6

Used on OpenESC-30x30, Q1-Q24, 24 per board. Land pattern 4in1ESC-30x30:PDFN-8L_L6.0-W5.0-P1.27: two rows of four leads 0.58 x 1.08 mm at y +/-2.83, so pads spanning y 2.29 to 3.37, 1.27 mm pitch, plus a 4.4 x 4.1 mm drain pad centred at y -0.69. Pins 1-3 source, 4 gate, 5-8 drain.

Fitted: SP40N01GHNK, C22385416.

The fitted part has two datasheet revisions under one part number, and they disagree about the two parameters that decide this whole section.

	Ver-1.0	Ver-1.1
EAS	490 mJ	1089 mJ
RthJC	1.27 C/W	0.96 C/W
PD	98 W	130 W
Qg typ	119 nC	126 nC

Both documents are internally self-consistent, so this is a real silicon or process change that Siliup shipped without touching the MPN. That is exactly the case where a reorder silently returns the older die. Confirm the revision against the reel date code before treating 1089 mJ as the bar. The table below is ranked against Ver-1.1. If Ver-1.0 is what ships, every row from TPHR8504PL down improves relative to it.

Verified 2026-08-29. Every row read from the manufacturer datasheet.

Part	Vendor	LCSC	Package, body mm	VDSS	RDS(on) max @10V	Qg @10V	EAS	RthJC	Stock	$@1k
SP40N01GHNK (fitted)	Siliup	C22385416	PDFN5x6	40 V	1.5 mOhm	126 nC typ	1089 mJ	0.96	1632	0.331
NCEP40T15AGU	NCE Power	C5119012	DFN5X6-8L 4.90 x 6.00	40 V	1.5 mOhm	62 nC	1620 mJ	0.93	4017	0.490
PSMN1R4-40YLD	Nexperia	C458253	LFPAK56 4.9 x 6.0	40 V	1.4 mOhm	143 max	1641 mJ	0.56	802	0.315
TPHR8504PL	Toshiba	C22388172	SOP Advance, see note	40 V	0.85 mOhm	103 nC	336 mJ	0.88	37632	0.517
HYG009N04LS1C2	Huayi	C2890387	PDFN5x6-8L 5.20 x 6.15	40 V	0.96 mOhm	89 nC	780 mJ	2.0	14231	0.425
XRS225N04LF	XinRui	C50314145	PDFN-8L 5x6	40 V	1.0 mOhm	118 nC	627 mJ	1.1	1896	0.316
NCEP40T13GU	NCE Power	C191993	DFN5X6-8L 4.90 x 6.00	40 V	2.3 mOhm	70 max	600 mJ	1.56	7226	0.339
CJAC200SN04U	JSCJ Changjing	C19268993	PDFNWB5x6-8L	40 V	0.90 mOhm	124 nC	760 mJ	1.2	1381	0.707
APG013N04G	ALLPOWER	C5443733	PDFN5x6-8L 5.10 x 6.05	40 V	1.3 mOhm	30 nC	473 mJ	1.9	3630	0.344
BSC010N04LS6	Infineon	C7220836	SuperSO8 5.15 x 6.15	40 V	1.0 mOhm	83 max	376 mJ	1.0	4705	0.535
DON160N04T	Doingter	C50386321	DFN5x6 clip 5.20 x 6.05	40 V	1.6 mOhm	66 nC	200 mJ	1.5	2804	0.297

EAS in mJ is not comparable across vendors. Test inductance in this table spans 18 uH to 0.5 mH, a 28x range, and energy scales with L at fixed current. Back-computing avalanche current from EAS = 0.5 L I^2 is the honest comparison, and it reorders the table:

Part	IAS
TPHR8504PL	120 A stated
NCEP40T15AGU	80.5 A
HYG009N04LS1C2	72.1 A
SP40N01GHNK (fitted)	66.0 A
DON160N04T	63.2 A
XRS225N04LF	56.0 A
CJAC200SN04U	55.1 A
NCEP40T13GU	49.0 A
APG013N04G	43.5 A

PSMN1R4-40YLD is the only part in the class publishing an avalanche curve rather than a single point: 1641 mJ at ID 25 A and 446 mJ at ID 74 A, IAS 190 A, 100% tested.

The gate is avalanche, not RDS(on). OpenESC-30x30 has no input clamp. The avalanche-rated FET is the overvoltage backstop, by design (OpenDrone-Testing/Tests/ESC/ESC-17-overvoltage-rationale.md). 8S charged is 33.6 V against a 40 V part, so avalanche capability is the margin.

30 V parts do not belong on this board. 8S charged is above their breakdown. A 30 V part is a valid alternate only if the board is re-rated to 6S. The 40 V floor is what buys 8S in the first place.

Gate charge is not the binding constraint, and an earlier revision of this file said it was. The fitted part is 126 nC typ, not the ~70 nC previously recorded here. The real arithmetic: 24 FETs x 126 nC x 24 kHz = 72.6 mA, so the board already spends 12.1% of the LMR54406's 0.6 A rail on gate charge and works. The worst part in the table, PSMN1R4-40YLD at 143 nC max, is 82.4 mA or 13.7%. Nothing here loads the rail meaningfully harder than what is fitted. Driver dissipation and edge rate still move with Qg; rail headroom does not.

Land pattern: almost everything in this size class fits

The reference drain land is 4.4 x 4.1 mm, larger than the fitted part's own exposed pad at 4.01 x 3.48, so it has margin to spare. Computed from each datasheet's own overall length, lead length and exposed pad, against pads spanning y 2.29 to 3.37:

Part	Lead y-span	Exposed pad
SP40N01GHNK (fitted)	2.39-3.02	4.01 x 3.48
NCEP40T15AGU	2.39-3.00	3.81 x 3.58
TPHR8504PL 2-5W1A	2.40-3.05	4.21 x 3.69
TPHR8504PL 2-5Q1S	2.20-3.00	4.25 x 3.50
DON160N04T	2.38-3.02	4.00 x 4.10
HYG009N04LS1C2	2.48-3.08	4.10 x 3.77
JMSH0401AGQ	2.38-3.08	4.10 x 3.53
AGM403A1	2.39-3.08	4.01 x 3.48

Nexperia LFPAK56 is the one genuine footprint outlier. It is a copper clip package with four gullwing leads on one side plus a drain tab, not an 8-lead DFN. PSMN1R4-40YLD needs a second footprint and its own copper pour.

Three parts overrun a 5.2 x 6.2 window at maximum material condition and their courtyards must be drawn to MMC, not nominal: HYG009N04LS1C2 (5.4 x 6.35), JMSH0401AGQ (5.4 x 6.25) and XRS225N04LF (5.4 x 6.15).

TPHR8504PL: one MPN, two packages. Toshiba ships it as either 2-5Q1S (SOP Advance, 5.0 x 6.0 overall, gullwing) or 2-5W1A (SOP Advance(N), 5.15 x 6.10 overall, flat lead). Both land on our pattern, per the table above, so the ambiguity is not a blocker here, but the part number does not determine what arrives and a stencil check has to cover both. Its V(BR)DSS is also specified at ID = 10 mA, looser than the 250 uA every Chinese vendor in the table uses, and V(BR)DSX collapses to 25 V min at VGS = -20 V.

What actually beats the fitted part

NCEP40T15AGU. Higher avalanche current at an identical L = 0.5 mH test condition, the only like-for-like avalanche comparison available. Half the gate charge, marginally better RthJC, same RDS(on) max, lands on the existing copper. Costs $3.81 more per board. 4017 pieces is 167 boards, so it has to be reserved before a batch, not after.

PSMN1R4-40YLD is the strongest technical answer to what this board actually fails at: copper clip with solder die attach, Rth(j-mb) 0.56 against the fitted 0.96, and the most rigorously characterised avalanche behaviour in the class. It is currently cheaper than the fitted part. It is held back by 802 pieces and by being the one real footprint job.

Note the fitted part is down to 1632 pieces, 68 boards. That is the near-term constraint regardless of what this section concludes.

Not checked for any part in this class: repetitive avalanche EAR/IAR ratings, AEC-Q101 status, MSL and reflow profile, and body-diode reverse recovery under this board's real di/dt. Datasheet Qrr is measured at 100 A/us, likely optimistic here.

Power MOSFET, DFN 3x3

Used on OpenESC-20x20, Q1-Q24, 24 per board. Land pattern Package_SON:Diodes_PowerDI3333-8 (KiCad global library, not the project library). Four lead pads 0.7 x 0.42 mm at x -1.5 on 0.65 mm pitch (three source, one gate), four matching pads at x +1.5 for the drain leads, and a 1.71 x 1.71 mm drain tab at x +0.455. The four drain-lead pads carry no pad number in that footprint, so KiCad gives them no net: they solder to the part but are invisible to DRC.

Fitted: DOY180N03T, C49441966, 30 V.

Verified 2026-08-29. AON7140, APG035N04Q and SP40N03GNJ were verified in the 2026-08-27 pass from datasheets in OpenESC-20x20/hardware/datasheets/ and their stock and price columns were not re-pulled, so those three are older than the rest of the table.

Part	Vendor	LCSC	Package, body mm	VDSS	RDS(on) @10V	Qg @10V	EAS	RthJC	Stock	$
DOY180N03T (fitted)	Doingter	C49441966	TDFN3333-8PL 3.30 x 3.30	30 V	1.0 typ / 1.2 max	39.8 nC	100 mJ	0.33, see note	1815	0.184 @5k
DOY170N04T	Doingter	C50386319	TDFN3333-8PL 3.30 x 3.30	40 V	1.7 typ / 2.2 max	39.8 nC	200 mJ	0.70	2437	0.286
JMSL0302AU	JieJie JJM	C2890409	PDFN3x3-8L 3.28 x 3.33	30 V	1.2 typ / 1.5 max	39 nC	101 mJ	2.5 max	4680	0.157 @500
IQE013N04LM6	Infineon	C3289346	PG-TSON-8-4 3.30 x 3.30	40 V	1.1 typ / 1.35 max	55 max	255 mJ	1.4 max	90	1.582
BSZ018N04LS6	Infineon	C534643	PG-TSDSON-8 FL 3.30 x 3.30	40 V	1.6 typ / 1.8 max	31 nC	189 mJ	1.8 max	93	1.073
AON7418	Alpha & Omega	C74384	DFN3.3x3.3, see note	30 V	1.4 typ / 1.7 max	65 max	109 mJ	1.5 max	483	0.341
NCEP4065QU	NCE Power	C502974	DFN3.3x3.3-8L 3.35 x 3.30	40 V	2.2 typ / 2.8 max	34.8 nC	500 mJ	2.3	1910	0.346
TPN2R304PL	Toshiba	C5802634	TSON Advance, see note	40 V	1.8 typ / 2.3 max	41 nC	39 mJ	1.43	2595	0.457
PTQ10HN03B	HT JinYu	C49384054	PDFN3333 3.15 x 3.05	30 V	3.1 typ / 4.0 max	55 nC	163 mJ	2.31	4670	0.069
XRS80N04D	XinRui	C50314143	PDFN3333-8L 3.15 x 3.30	40 V	3.4 typ / 4.5 max	32 nC	125 mJ	1.9 max	3025	0.102
AON7140	Alpha & Omega	C2758662	DFN3x3	40 V	1.9 typ / 2.3 max	42 typ / 60 max	135 mJ	not read	2131	0.491
APG035N04Q	ALLPOWER	C5443653	PDFN3x3	40 V	2.8 typ / 3.5 max	20.3 nC	100 mJ	2.42	1436	0.143
SP40N03GNJ	Siliup	C22466709	PDFN3x3	40 V	2.9 typ	26 nC	169 mJ	2.27	958	0.111 @5k
PSMN3R3-40MSH	Nexperia	none	LFPAK33 (SOT1210), see note	40 V	2.6 typ / 3.3 max	42 max	200 mJ	1.48 max	not listed	n/a

Body dimensions not read from a mechanical drawing, so the package column is screened for these three: AON7418, whose datasheet contains no package outline drawing at all (the 3.3 x 3.3 is a page-1 label); TPN2R304PL, taken from Toshiba's package designation; and PTQ10HN03B, whose name refers to the 3.30 x 3.30 lead span, not the 3.15 x 3.05 body. PTQ10HN03B also publishes two different bottom-view pad options under one package name with no statement of which one ships.

EAS test conditions differ here as they do in the 5x6 class. AON7140 is at L 0.3 mH and IAS 30 A, softer than the 0.5 mH the Doingter and NCE parts use, so the mJ figures are not directly comparable.

DOY170N04T is the only zero-work change in this class. Same vendor, same TDFN3333-8PL drawing symbol for symbol as the fitted part, so it drops onto the existing land pattern. It doubles EAS to 200 mJ and buys 8S headroom, at 2.2 mOhm max against 1.2, roughly +83% conduction loss per FET.

JMSL0302AU is the natural qualified second source. 1.5 mOhm max against the fitted 1.2 at the same 39 nC, with 2.6x the stock at 60% of the price and an honestly published thermal number. It stays 30 V, so it does nothing for cell count.

Every 40 V row costs conduction loss. The trade is cell count, since 30 V VDSS is what caps OpenESC-20x20 and OpenAIO at 6S. Take a 40 V part only if the board is being re-rated, and re-run the thermal case, not just the arithmetic.

The thermal ranking in this class is unanchored. The fitted part's stated 0.33 C/W RthJC is back-computed from PD = 379 W at TC = 25 C in a 3.3 x 3.3 mm package, which is not a physical figure. The same vendor's identical package drawing states PD = 179 W and RthJC = 0.70 C/W for DOY170N04T, a factor of two in the same package. Nobody has measured either, and the measured 20x20 failure mode is FET joint reflow, so this is the number that matters most and the one least worth trusting.

Following from that: nobody has computed at what phase current DOY170N04T's 2.2 mOhm reaches the same die temperature the fitted part reaches at 1.2 mOhm, on the 20x20's real copper and airflow. That calculation decides whether the 40 V drop-in is adoptable, and it needs a measured board RthJA, not a datasheet RthJC.

Not buildable today: IQE013N04LM6 at 90 pieces, BSZ018N04LS6 at 93 and AON7418 at 483. At 24 FETs per board, 90 pieces is under four boards. BSZ018N04LS6 is the best part in the class on paper and is effectively out of stock.

PSMN3R3-40MSH is the only different thermal construction available. LFPAK33 is a copper clip package rated to 175 C junction with 1.48 C/W max to the mounting base, which is the most direct structural answer to solder joint reflow. It has no LCSC listing, is Mouser/DigiKey/Farnell only, and needs a completely new footprint: four clip leads on one side plus a drain mounting base, not an 8-lead DFN. PSMN1R6-40YLC and PSMN1R8-40YLC were screened and dropped earlier for being LFPAK56, which is the 5 x 6 package; LFPAK33 is the 3.3 x 3.3 member of the same family and does belong in this class.

Three-phase gate driver, QFN-24 4x4

Used on OpenESC-30x30 (U4, U6, U8, U10), OpenESC-20x20 (U3, U7, U9, U11) and OpenAIO, four per board. Land pattern 4in1ESC:QFN-24_L4.0-W4.0-P0.50-TL-EP2.8: 24 pads 0.55 x 0.28 mm on 0.5 mm pitch, pin 1 top left, plus a 1.4 x 1.4 mm centre pad.

Fitted: NSG2065Q, C41414478.

Reference pinout, which every part below matches exactly:

Pin	1	2	3	4	5	6	7	8	9	10	11	12
	LIN1	LIN2	LIN3	VCC	NC	COM	NC	NC	LO3	LO2	LO1	VS3

Pin	13	14	15	16	17	18	19	20	21	22	23	24
	HO3	VB3	VS2	HO2	VB2	VS1	HO1	VB1	NC	HIN1	HIN2	HIN3

An integrated bootstrap diode is mandatory. Neither ESC carries a single diode: the 30x30 board has 24 Q, 93 C, 81 R, 13 U and no D at all, and the 20x20 is the same. A pin-compatible driver without the internal diode has no path to charge the bootstrap capacitor and will not run the high side. Non-inverting input logic is also mandatory, because AM32 drives these non-inverted.

Part	LCSC	Pinout	Integrated BSD	Stock	$@1k
NSG2065Q (fitted)	C41414478	verified	yes	4876	0.239
6288Q-MNS	C49424413	verified	yes	9295	0.178 @5k
HL6288Q	C50331902	verified	yes	6020	0.182 @500
SD6288Q	see note	verified	yes	n/a	n/a
JSM6288Q	C52196409	verified	not confirmed	2513	0.278
FD6288Q	C328453	verified	yes	66	n/a
NSG20652Q	C41414479	screened	screened	1367	0.310
G2063Q	C49449773	screened	screened	5486	0.239
HXFD6288QFN24	C54423134	screened	screened	2967	0.227 @500
SL6288Q	C53085155	screened	screened	417	0.126 @5k
ZH639D0NU	C53184465	screened	screened	1628	0.278

6288Q-MNS, HL6288Q and JSM6288Q pinouts were read from the datasheets in OpenESC-20x20/hardware/datasheets/. FD6288Q is the original that the family clones and is nearly out of stock; the clones are the supply.

SD6288Q has a verified pinout and integrated BSD but no LCSC listing under that number. What LCSC stocks is SD6287Q, C44606225, 7458 pieces. In this family the 6287 suffix marks the variant without the bootstrap diode, exactly as FD6287 does against FD6288. Confirm before ordering; the datasheet on disk is for the 6288.

Same package, will not work:

Part	LCSC	Why not
DRV8300NLQ	C50345924	Pin-compatible, pins 5 and 21 become MODE and DT and both default correctly when floating, but the N variant has no bootstrap diode. DRV8300D is the one with diodes. DRV8300DI and NI invert the low-side logic.
EG2124A	C2856308	Pin-compatible three-phase driver, but its own datasheet specifies an external bootstrap diode.
AMT49406, SBD63006, FT1215Q, FT8132Q, FT8215Q, MS8829	various	BLDC controllers with integrated output stages or I2C, not gate drivers. Unrelated pinouts.

The 1.4 x 1.4 mm centre pad is worth noting: the NSG2065Q exposed pad is 2.6 to 2.8 mm square, so the land is about a quarter of its area. That undersizing applies equally to every part in this table, which makes vendor differences in exposed pad size irrelevant to the choice.