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Updated WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm_ThermalVias heatsink pad vias to use heatsink property
See merge request kicad/libraries/kicad-footprints!3961
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@ -269,6 +269,7 @@
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(at 0 -0.5)
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(size 0.6 0.6)
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(drill 0.25)
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(property pad_prop_heatsink)
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(layers "*.Cu")
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(remove_unused_layers no)
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(uuid "700d9ec9-ad49-457a-bef4-155f2e0f49dd")
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@ -289,6 +290,7 @@
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(at 0 0.5)
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(size 0.6 0.6)
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(drill 0.25)
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(property pad_prop_heatsink)
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(layers "*.Cu")
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(remove_unused_layers no)
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(uuid "9ee61e08-319c-41ab-989a-38bc3cbf7434")
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