AllSpiceMirrors/kicad-footprints
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295 Commits

Author SHA1 Message Date
André Colomb
e0555113f1 Add 3D model path. 
Reference a WRL model within the KISYS3DMOD path.
 2018-06-05 23:26:01 +02:00
André Colomb
d0cc0e5a15 Add 18-pin variant of SSOP used by Toshiba. 
This is a slight modification of the existing SSOP-20 footprint, with
only two pins removed and symmetry restored.

Reference is the TBD62083A datasheet at
https://toshiba.semicon-storage.com/info/docget.jsp?did=29893

The linked part is mostly equivalent and pin-compatible to an ULN2804A
darlington array, so its schematic symbol can be used.
 2018-06-05 19:57:28 +02:00
evanshultz
107d00e184
Merge pull request from thomasonw/DVR887x-footprint 
Corrected name
 2018-06-01 10:00:41 -07:00
evanshultz
e15d684b8b
Fix paste pad to have no pin number 2018-05-31 09:33:03 -07:00
evanshultz
4da0b3f395
Fix to match datasheet 2018-05-31 09:27:16 -07:00
Martin Kröll
3baf42b1b3 Add PSOP-18 2018-05-31 00:21:11 +02:00
Martin Kröll
0bc02fcbc6 Fix 3D shape of SSOP-18 2018-05-30 22:53:41 +02:00
Martin Kröll
f4c8922dc3 Add SSOP-18 package 2018-05-30 22:42:40 +02:00
thomasonw
55736c19e1 Corrected name 
Changed to:
Texas_HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.4x3.1mm_ThermalVias
 2018-05-28 08:34:27 -07:00
thomasonw
fc9c111112 Corrected name 
Corrected name to reflect thermal-pad dimensions
 2018-05-26 10:26:08 -07:00
evanshultz
c21659314f
Merge pull request from johnfwhitmore/BTS7004-1EPP 
Infineon BTS7004-1EPP
 2018-05-25 14:53:42 -07:00
John Whitmore
006006f7d3 Corrected the courtyard to comply with KLC F5.3 2018-05-23 22:01:05 +01:00
evanshultz
afcf24271d
Merge pull request from thomasonw/DRV887x-footprint 
Drv887x footprint
 2018-05-17 17:27:58 -07:00
thomasonw
997d8b019d Edits 2018-05-17 17:23:14 -07:00
thomasonw
e97cd00ed8 Edits 2018-05-17 17:22:49 -07:00
thomasonw
0ef02ec540 Manualy removed 'Package_SO:' prefix 
I have not fogured out what is causing the lib prefix to be added to my
footprint submissions.

Am manualy editing them out.
 2018-05-16 16:43:32 -07:00
thomasonw
0b7736be65 Edits - renamed 2018-05-11 11:58:23 -07:00
John Whitmore
a96d1cc13f Corrected courtyard clearance 2018-05-09 17:43:39 +01:00
evanshultz
a29cd9a712 Minor footprint fixes (3D models and footprint name) () 
* Add 3D model reference

* Rename HTSOP-8-1EP_3.9x4.9mm_P1.27mm* to reflect the fact that they are manufacturer specific
    * Change them to comply to the currently suggested pad stackup for exposed pads and the manufacturer suggestions.
 2018-05-08 16:53:34 +02:00
John Whitmore
fe9309931b Corrected one of the pads 2018-05-08 09:58:53 +01:00
John Whitmore
7953af5221 Changed from polygon to rectangle 2018-05-05 12:47:41 +01:00
John Whitmore
cb2a12f44d Corrected the paste layer on the exposed pad 2018-05-05 10:30:59 +01:00
thomasonw
848dd0b49a Renamed 2018-05-04 14:43:55 -07:00
thomasonw
42c168704f Revised thermal pad 2018-05-04 14:34:18 -07:00
John Whitmore
82f597caa9 Added footprint Infineon PG-TSDSO-14-22 for the BTS7004-1EPP Profet 2018-05-04 18:26:25 +01:00
thomasonw
6cd987548c Github recovery 2018-05-03 18:30:34 -07:00
Al Thomason
d19063a881
Travis 2018-05-03 17:59:06 -07:00
thomasonw
11e0238cbb Manually Edited package name 2018-05-03 17:31:18 -07:00
thomasonw
3e593dbc03 Footprint addition to support DRV887x devices 
Modification of  Package_SO:HTSOP-8-1EP_3.9x4.9mm_P1.27mm, this package
adjusted the thermal pad and pins to match the TI specifications
 2018-05-03 17:10:56 -07:00
evanshultz
f935bce15f
Merge pull request from awygle/micrel_msop 
Add MSOP-8 package w/ large thermal pad for Micrel MIC5355
 2018-05-02 13:11:14 -07:00
Andrew Wygle
4a09de6098 Correct silkscreen position. Increase paste coverage for MLF. Remove DFN 
references from MLF.
 2018-04-30 23:17:14 -07:00
Rene Pöschl
5b9c304054 TSOP-5 should have pin numbers 1...5 as in the datasheet. 2018-04-24 10:49:14 +02:00
Rene Pöschl
0795c3ec58
Merge pull request from aimylios/ti_pwp0020a 
Package_SO: Add TI PWP0020A HTSSOP-20
 2018-04-23 20:49:48 +02:00
Andrew Wygle
446120d0d7 Renamed DFN to MLF. Improved paste coverage. Some cleanup. 2018-04-21 15:26:16 -07:00
Aimylios
2ff5c47ca4 Package_SO: Add TI PWP0020A HTSSOP-20 2018-04-17 21:55:34 +02:00
Andrew Wygle
a67ac52b52 Modified MSOP footprint to match datasheet more closely. 
Also added new DFN footprint.
 2018-04-13 22:09:37 -07:00
Andrew Wygle
5c77bab527 Added 3D model path 2018-04-11 22:54:40 -07:00
Andrew Wygle
94891023e5 Fixed invalid pad name on paste layer. 2018-04-11 22:51:22 -07:00
Andrew Wygle
51079a6868 Set both footprints to "Surface Mount". 
Also added datasheet and description.
 2018-04-11 22:49:37 -07:00
Andrew Wygle
3e0a9b8c21 Add MSOP-8 package w/ large thermal pad for Micrel MIC5355 2018-04-11 22:36:21 -07:00
evanshultz
4f4e6fb6fb
Merge pull request from daab4848/branch_fprintsfixes 
Added Package_SO:TSOP-28_11.8x8mm_P0.55mm
 2018-04-06 09:42:59 -07:00
daab4848
f7bbe0ed10 Filename, value text, and metadata should all be the same now. 2018-04-05 16:46:10 -06:00
daab4848
9583c6649c Removed the unnecssary text on Fab Layer...again 2018-04-05 16:41:06 -06:00
daab4848
96a6ed6c2b Fixed footprint filename and metadata 2018-04-05 16:39:06 -06:00
daab4848
08f9db6f70 Removed unnecessary text from F.Fab 2018-04-05 16:34:50 -06:00
daab4848
12260b3463 Removed Microchip from keywords 2018-04-05 07:26:07 -06:00
daab4848
0277e33680 Edited 3D model file path. Should be fixed. 2018-04-05 07:24:39 -06:00
daab4848
7fd3178e47 Fixed pin 1 mark and courtyard clearance. 2018-04-03 22:01:09 -06:00
daab4848
ab99eb72b8 Removed description from fab layer. Renamed file to TSOP-I-28_11.8x8mm_P0.55mm. 2018-04-03 21:55:03 -06:00
daab4848
e5ba845ca6 Added keywords for footprint 2018-04-03 21:52:37 -06:00
daab4848
00852d70cf Added more stuff to footprint description 2018-04-03 21:50:39 -06:00
Clayton G. Hobbs
277b8aa9de
Merge pull request from evanshultz/ssop10 
Add SSOP-10_3.9x4.9mm_P1.00mm
 2018-03-31 19:29:58 -04:00
evanshultz
741ab49609
Fixed courtyard 2018-03-31 15:02:41 -07:00
Clayton G. Hobbs
5d14d6dfe5
Merge pull request from evanshultz/soic7-1 
Create SOIC-8-N7_3.9x4.9mm_P1.27mm
 2018-03-31 13:14:27 -04:00
evanshultz
db08a3e37c
Rename SOIC-8-N7_3.9x4.9mm_P1.27mm to SOIC-8-N7_3.9x4.9mm_P1.27mm.kicad_mod 2018-03-31 10:08:52 -07:00
daab4848
2e5fb54651 Removed incorrect 3D model 2018-03-27 22:27:17 -06:00
daab4848
f354f51818 Copper width sized to 1.87. Moved copper pads to +/- 6.27mm 2018-03-27 20:36:07 -06:00
daab4848
b7a04b757a Included document and copper size note 2018-03-27 20:21:24 -06:00
Misca1234
644d37f706 changed F.silk to 0.12 and F.Fab to 0.1 2018-03-25 17:42:21 +02:00
daab4848
c8cb3d62dd Changed pad length to 1.9mm 2018-03-20 22:44:11 -06:00
daab4848
6a0490af27 Increased pad thickness 2018-03-20 22:35:28 -06:00
evanshultz
e999f836e2
Update URL to one with pad dimensions 2018-03-20 09:08:10 -07:00
evanshultz
05f662eb7d
Add SSOP-10_3.9x4.9mm_P1.00mm 
http://www.st.com/resource/en/datasheet/l4984d.pdf
 2018-03-19 20:20:30 -07:00
evanshultz
a1ba9ebc47
Create SOIC-8-N7_3.9x4.9mm_P1.27mm 2018-03-19 12:18:56 -07:00
daab4848
2bbb99fd1a Added Package_SO:TSOP-28_11.8x8mm_P0.55mm 2018-03-14 22:00:34 -06:00
evanshultz
24a2d279ab
Add missing footprints from I2C fix 2018-03-01 20:56:47 -08:00
Sebastian Basierski
7cebbe5f3a Package_SO: fix ssop-8.3.95x5.21x3.27mm_P1.27mm 
There are 2 pads with number '1'.
One of that pair should be named as '8'.

Signed-off-by: Sebastian Basierski <sebastian@basierski.pl>
 2018-02-19 18:16:54 +01:00
Stefan Olsson
f62b429042 Corrected the pad size and position 2018-02-14 21:53:56 +01:00
Stefan Olsson
b27c40ce87 Corrected the pad size and position 2018-02-14 21:53:43 +01:00
Stefan Olsson
2a3c0fdfba Attempt to center it again 2018-02-11 15:02:23 +01:00
Stefan Olsson
bc1706aece Attempt to center it again 2018-02-11 14:52:46 +01:00
Stefan Olsson
063b9e1f98 Attempt to center it again 2018-02-11 14:46:34 +01:00
Stefan Olsson
e084cf4e6a Attempt to center it again 2018-02-11 14:43:21 +01:00
Stefan Olsson
869e2e52c2 Removed 2018-02-11 14:40:17 +01:00
Stefan Olsson
6ad009add6 Removed 2018-02-11 14:40:06 +01:00
Stefan Olsson
eb6622f978 Renamed 2018-02-11 14:37:33 +01:00
Stefan Olsson
aeb68add81 renamed 2018-02-11 14:37:23 +01:00
Stefan Olsson
7060f64d92 Centered the foot print anchor 2018-02-11 14:12:45 +01:00
Stefan Olsson
6c77ad128a Centered the foot print anchor 2018-02-11 13:25:40 +01:00
Stefan Olsson
3352cf510f New 8 mm clearence model 2018-02-10 14:38:49 +01:00
Stefan Olsson
4226b182a3 New 8 mm clearence model 2018-02-10 14:38:17 +01:00
Stefan Olsson
209ef2de8d obselete 2018-02-10 11:51:56 +01:00
Stefan Olsson
9b1bf0d551 New 8 mm clearence model 2018-02-10 11:51:24 +01:00
Stefan Olsson
a0d435a090 Added DIP-4 and DIP-8 with 8mm clearence, 2.54 pitch 2018-02-10 08:52:20 +01:00
Stefan Olsson
6083432b6b Added DIP-4 and DIP-8 with 8mm clearence, 2.54 pitch 2018-02-10 08:51:57 +01:00
Stefan Olsson
3e9a01e811 Added DIP-4 and DIP-8 with 8mm clearence, 2.54 pitch 2018-02-09 22:54:35 +01:00
Stefan Olsson
74a7a1c6a0 Added DIP-4 and DIP-8 with 8mm clearence, 2.54 pitch 2018-02-09 21:35:01 +01:00
Stefan Olsson
5210ba3df8 Added DIP-4 and DIP-8 with 8mm clearence, 2.54 pitch 2018-02-09 21:34:44 +01:00
El3ctr0nic
80787abb91 Change description and keywords 2018-02-05 21:30:45 +01:00
El3ctr0nic
db88c28e7a Change description and tags 2018-02-04 21:15:08 +01:00
El3ctr0nic
2658ed86c5 Add SOIC-16W-12 for HCP-314J 2018-02-03 16:49:53 +01:00
strombom
9187fd87ce Change reference to 3D model in new Package_SO folder 2018-02-02 14:58:58 +01:00
strombom
1aff62d1e9 Move SSOP-8_3.95x5.21x3.27mm_P1.27mm to the new Package_SO folder 2018-02-02 14:58:10 +01:00
strombom
6dd463a1df Update 3D model paths 2018-02-01 18:54:04 +01:00
strombom
98a71250f6 Merge SOIC and SSOP into Package_SO 2018-02-01 17:21:02 +01:00