7
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kicad/qa/data/pcbnew/issue18142.kicad_pcb

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(kicad_pcb
(version 20240225)
(generator "pcbnew")
(generator_version "8.99")
(general
(thickness 0.5854)
(legacy_teardrops no)
)
(paper "A4")
(title_block
(title "Optimistic Proteus")
(date "2024-01-23")
(rev "0.6.0")
(company "epyMetrics AG")
(comment 1 "CONFIDENTIAL")
)
(layers
(0 "F.Cu" signal)
(1 "In1.Cu" signal)
(2 "In2.Cu" signal)
(3 "In3.Cu" signal)
(4 "In4.Cu" signal)
(31 "B.Cu" signal)
(32 "B.Adhes" user "B.Adhesive")
(33 "F.Adhes" user "F.Adhesive")
(34 "B.Paste" user)
(35 "F.Paste" user)
(36 "B.SilkS" user "B.Silkscreen")
(37 "F.SilkS" user "F.Silkscreen")
(38 "B.Mask" user)
(39 "F.Mask" user)
(40 "Dwgs.User" user "User.Drawings")
(41 "Cmts.User" user "User.Comments")
(42 "Eco1.User" user "User.Eco1")
(43 "Eco2.User" user "User.Eco2")
(44 "Edge.Cuts" user)
(45 "Margin" user)
(46 "B.CrtYd" user "B.Courtyard")
(47 "F.CrtYd" user "F.Courtyard")
(48 "B.Fab" user)
(49 "F.Fab" user)
(50 "User.1" user "Nearby Mechanical Objects")
(51 "User.2" user "Coil Surface Declaration")
(52 "User.3" user "Rigid Area")
(53 "User.4" user "Non-bending flex Area")
(54 "User.5" user "Impedance Control F")
(55 "User.6" user "Impedance Control B")
(58 "User.9" user "Bending lines")
)
(setup
(stackup
(layer "F.SilkS"
(type "Top Silk Screen")
)
(layer "F.Paste"
(type "Top Solder Paste")
)
(layer "F.Mask"
(type "Top Solder Mask")
(thickness 0.0127)
)
(layer "F.Cu"
(type "copper")
(thickness 0.035)
)
(layer "dielectric 1"
(type "prepreg")
(color "Polyimide")
(thickness 0.067)
(material "Polyimide")
(epsilon_r 3.2)
(loss_tangent 0.004)
)
(layer "In1.Cu"
(type "copper")
(thickness 0.035)
)
(layer "dielectric 2"
(type "core")
(color "Polyimide")
(thickness 0.068)
(material "Polyimide")
(epsilon_r 3.2)
(loss_tangent 0.004)
)
(layer "In2.Cu"
(type "copper")
(thickness 0.035)
)
(layer "dielectric 3"
(type "prepreg")
(color "FR4 natural")
(thickness 0.08)
(material "FR4")
(epsilon_r 4.5)
(loss_tangent 0.02)
)
(layer "In3.Cu"
(type "copper")
(thickness 0.035)
)
(layer "dielectric 4"
(type "core")
(color "Polyimide")
(thickness 0.068)
(material "Polyimide")
(epsilon_r 3.2)
(loss_tangent 0.004)
)
(layer "In4.Cu"
(type "copper")
(thickness 0.035)
)
(layer "dielectric 5"
(type "prepreg")
(color "Polyimide")
(thickness 0.067)
(material "Polyimide")
(epsilon_r 3.2)
(loss_tangent 0.004)
)
(layer "B.Cu"
(type "copper")
(thickness 0.035)
)
(layer "B.Mask"
(type "Bottom Solder Mask")
(thickness 0.0127)
)
(layer "B.Paste"
(type "Bottom Solder Paste")
)
(layer "B.SilkS"
(type "Bottom Silk Screen")
)
(copper_finish "None")
(dielectric_constraints no)
)
(pad_to_mask_clearance 0)
(allow_soldermask_bridges_in_footprints no)
(aux_axis_origin 145 85)
(grid_origin 145 0)
(pcbplotparams
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(plot_on_all_layers_selection 0x0021000_00000000)
(disableapertmacros no)
(usegerberextensions no)
(usegerberattributes yes)
(usegerberadvancedattributes yes)
(creategerberjobfile yes)
(dashed_line_dash_ratio 12.000000)
(dashed_line_gap_ratio 3.000000)
(svgprecision 4)
(plotframeref no)
(viasonmask no)
(mode 1)
(useauxorigin no)
(hpglpennumber 1)
(hpglpenspeed 20)
(hpglpendiameter 15.000000)
(pdf_front_fp_property_popups yes)
(pdf_back_fp_property_popups yes)
(pdf_metadata yes)
(dxfpolygonmode yes)
(dxfimperialunits yes)
(dxfusepcbnewfont yes)
(psnegative no)
(psa4output no)
(plotreference yes)
(plotvalue yes)
(plotfptext yes)
(plotinvisibletext no)
(sketchpadsonfab no)
(plotpadnumbers no)
(subtractmaskfromsilk no)
(outputformat 5)
(mirror no)
(drillshape 0)
(scaleselection 1)
(outputdirectory "")
)
)
(net 0 "")
(net 1 "/core/FLASH_QSPI_IO3")
(gr_rect
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(stroke
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(type default)
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(fill none)
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)
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(connect_pads yes
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(filled_areas_thickness no)
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(island_removal_mode 1)
(island_area_min 10)
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