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This board is for RW board v8.0 and RW card v1.0. Note specialized Makefile for flex board including stiffeners.
182 lines
6.5 KiB
Markdown
182 lines
6.5 KiB
Markdown
---
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title: "**OreSat Reaction Wheel Flex Board**"
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subtitle: |
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**Fabrication and Assembly Information**\
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For build TIME-STAMP
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fontsize: 10pt
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geometry:
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- margin=0.5in
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toc: true
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toc-depth: 2
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colorlinks: true
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urlcolor: blue
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---
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\newpage
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# About this Board
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## Board Description
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This flexible circuit board connects the OreSat Reaction Wheel boards (the boards that control each reaction wheel) to the
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the OreSat RW Card, which handles the OreSat Power Domain for each RW. For more information, see the open source
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[OreSat CubeSat system](https://www.oresat.org/)
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## Documentation Links
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- Git repository: <https://github.com/oresat/oresat-adcs-hardware>
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- **TODO:** Link to Design Notes + Design Review Notes
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## Documentation Files
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| Filename | Notes |
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| ------------------------------- | ---------------------------------------- |
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| README.pdf | This README file |
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| PROJECT-NAME-outline.dxf | Board outline (with holes) in DXF format |
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| PROJECT-NAME-pcba.step | 3D model of PCBA (with components) |
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| PROJECT-NAME-render-bot.jpg | Render of the top of the 3D model |
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| PROJECT-NAME-render-bot.jpg | Render of the bottom of the 3D model |
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| PROJECT-NAME-schematic.pdf | PDF of board schematics |
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## Contact Information
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- Website: <https://www.oresat.org/>
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- Email: <oresat@pdx.edu>
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- Instagram: @pdxaerospace
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## Board Renders
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{width=50%}
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{width=50%}
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\newpage
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# Printed Circuit Board (PCB) Fabrication Information
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## Board Info
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- 2 layer board
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- Bounding box is 41.0 x 10.2 mm
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- Board thickness uses 50um dielectric thickness
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- There are two PI (Polyimide) stiffeners on the TOP surface of the assembly
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## Board Requirements
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- Design Rules
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- Minimum Trace / Space design rules
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- Outer layers: 0.127 mm (5.0 mil) / 0.127 mm (5.0 mil)
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- Inner layers: 0.127 mm (5.0 mil) / 0.127 mm (5.0 mil)
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- Outer dimension router tolerance: +/- 0.254 mm (10.0 mil)
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- Hole placement tolerance: +/- 0.075 mm (3.0 mil)
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- Inner tab routed slot tolerance: +/- 0.254 mm (10.0 mil)
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- Drills
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- Drill Positional Tolerance: 0.051 mm (2.0 mil)
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- Drill Size tolerance: +/- 0.064 mm (2.5 mil)
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- Plated/Un-plated holes
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- PTH minimum diameter: 0.3 mm (11.8 mil)
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- PTH minimum annulus: 0.2 mm (7.9 mil)
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- Outline/Routing
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- No requirements
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- Slots
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- There are no slots.
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- Cutouts
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- There are no cutouts.
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- There are no fiducials.
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- Panel tabs ("mouse bites")
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- No requirements; prefer that board edges are smooth; no mouse bites or other intrusions into the card outline.
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- If external mouse bites are required, minimize and customer will remove by hand before assembly.
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- If not otherwise specified, build to IPC 6012 Class 2 or better.
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## Materials
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- No controlled impedance.
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- Outer layers must be 1 oz Copper.
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- Polyimide flexible circuit material
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- Board Surface treatment should be ENIG, althogh immersion Silver is acceptable.
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- White silkscreen on top and bottom surface
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- Any soldermask on top and bottom, no requirements for color.
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## Suggested Stack Up
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| Layer | Thickness | Notes |
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|---------------|----------------------|----------------------------------------------|
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| Top Copper | 0.043 mm / 1.69 mil | Layer 1 foil, 1 oz Cu after plating |
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| PI Core | 0.050 mm / 1.96 mil | Polyimide flex material |
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| Bottom Copper | 0.043 mm / 1.69 mil | Layer 2 foil, 1 oz copper after plating |
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## Array / Panel Information
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- No panel or array required.
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## Fabrication Files
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### IPC-2581 File
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| Filename | Notes |
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| ------------------------ | --------------------------------------- |
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| PROJECT-NAME-ipc2581.xml | IPC-2581 board information file |
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### Legacy PCB Files
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| Filename | Notes |
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| -------------------------------- | --------------------------------------------- |
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| PROJECT-NAME-Edge_Cuts.gbr | RS274X file for the dimension (outline) layer |
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| PROJECT-NAME-F_Silkscreen.gbr | RS274X file for the top silkscreen |
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| PROJECT-NAME-F_Mask.gbr | RS274X file for the top soldermask |
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| PROJECT-NAME-F_Cu.gbr | RS274X file for the top copper layer |
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| PROJECT-NAME-B_Cu.gbr | RS274X file for the bottom copper layer |
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| PROJECT-NAME-B_Mask.gbr | RS274X file for the bottom soldermask |
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| PROJECT-NAME-B_Silkscreen.gbr | RS274X file for the bottom silkscreen |
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| PROJECT-NAME-User_Stiffeners.gbr | RS274X file for PI stiffener |
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| PROJECT-NAME-PTH.drl | Excellon file for plated through holes |
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\newpage
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# Printed Circuit Board Assembly (PCBA) Information
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## Assembly Info
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- There are SMT components on the bottom side of the board.
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## Assembly Requirements
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- Assemble to IPC Class 2 or better
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- Bake components that are not moisture sealed to appropriate levels as required.
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- Solder paste MUST be leaded.
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- Aqueous flux and wash strongly preferred.
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- Clean to NASA Standard "Visibly Clean (VC)": No particles or residues are visible to the naked eye.
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- No conformal coating.
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- Ship in antistatic protective bag
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## Component Specific Assembly Information
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- No specific requirements.
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## Assembly Files
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### IPC-2581 File
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| Filename | Notes |
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| ------------------------ | ------------------------------- |
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| PROJECT-NAME-ipc2581.xml | IPC-2581 board information file |
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### Bill of Materials (BOM)
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| Filename | Description |
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| -------------------- | -------------------------------------- |
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| PROJECT-NAME-bom.csv | BOM in Comma Separated Variable format |
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### Solder Paste Stencils
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| Filename | Notes |
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| ------------------------ | ------------------------------------------------ |
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| PROJECT-NAME-B_Paste.gbr | RS274X file for top/front solder paste stencil |
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| PROJECT-NAME-F_Paste.gbr | RS274X file for bottom/back solder paste stencil |
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### Mounting/Placement Location
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| Filename | Description |
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| ------------------- | ------------------------------------------- |
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| PROJECT-NAME-3u.pos | Pick and place locations for components |
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