mirror of
https://github.com/oresat/oresat-c3-hardware.git
synced 2025-12-22 07:25:23 +00:00
09e19962c5
Added logo. Brought up to KiCAD 8.0.1. Added text next to smpm connectors. Fixed some 0.127 traces that didn't need to be that thin on nRESET. Fix silkscreen refdeses on new components. Move pin 1 marker on the BP0805A1308. Remove thermals on PA bottom layer. Added oresat-c3-eagle-import symbols and footprints so everything is local.
50 lines
2.8 KiB
Plaintext
50 lines
2.8 KiB
Plaintext
(footprint ".0402-C-NOSILK" (version 20211014) (generator pcbnew)
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(layer "F.Cu")
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(tedit 0)
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(descr "<b>0402 (metric 1005) tight 'IPC-C' without silkscreen</b>\n<br>In house package for minimum spacing based on IPC-7351B.\nThis package is identical to 0402-C, but has its tPlace silkscreen layer removed.")
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(fp_text reference "REF**" (at -0.7 -0.45) (layer "F.SilkS")
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(effects (font (size 0.68 0.68) (thickness 0.12)) (justify left bottom))
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(tstamp c150d6d2-a2fc-4ed4-b914-c0ac4e01db45)
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)
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(fp_text value ">VALUE" (at -0.7 1.25) (layer "F.Fab")
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(effects (font (size 0.68 0.68) (thickness 0.12)) (justify left bottom))
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(tstamp 40b82346-2925-4499-bf1a-8803202dd8fc)
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)
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) (layer "F.Mask") (width 0) (fill solid) (tstamp 2c2b1e92-869b-49e7-ace7-c399b5fca49f))
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) (layer "F.Fab") (width 0) (fill solid) (tstamp 2c80a1a3-2526-463f-bd9b-7e6acc887b31))
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(pad "1" smd roundrect (at -0.45 0) (size 0.5 0.6) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.1)
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(solder_mask_margin 0.0635) (tstamp 2cfd6ae6-0794-4fa9-ab17-06f9f0f0a746))
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(pad "2" smd roundrect (at 0.45 0) (size 0.5 0.6) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.1)
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)
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