mirror of
https://github.com/oresat/oresat-c3-hardware.git
synced 2025-12-22 23:34:08 +00:00
09e19962c5
Added logo. Brought up to KiCAD 8.0.1. Added text next to smpm connectors. Fixed some 0.127 traces that didn't need to be that thin on nRESET. Fix silkscreen refdeses on new components. Move pin 1 marker on the BP0805A1308. Remove thermals on PA bottom layer. Added oresat-c3-eagle-import symbols and footprints so everything is local.
38 lines
2.7 KiB
Plaintext
38 lines
2.7 KiB
Plaintext
(footprint "1.7X1.3" (version 20211014) (generator pcbnew)
|
|
(layer "F.Cu")
|
|
(tedit 0)
|
|
(fp_text reference "REF**" (at 2.54 1.27 90) (layer "F.SilkS")
|
|
(effects (font (size 0.51816 0.51816) (thickness 0.09144)) (justify left bottom))
|
|
(tstamp 812c19c3-fb49-4e8c-9f96-533f15b63c7a)
|
|
)
|
|
(fp_text value "" (at 0 0) (layer "F.Fab")
|
|
(effects (font (size 1.27 1.27) (thickness 0.15)))
|
|
(tstamp 8cfd1afe-37f8-4c61-b230-1a1316bac844)
|
|
)
|
|
(fp_line (start 0.9 0.7) (end 0.9 -0.7) (layer "F.SilkS") (width 0.1016) (tstamp 9c9b089b-7aeb-407b-aabd-2f5a8f50eac7))
|
|
(fp_line (start 0.9 -0.7) (end -0.9 -0.7) (layer "F.SilkS") (width 0.1016) (tstamp 9e7dbcf8-cce6-461f-99d1-e10e2e056119))
|
|
(fp_line (start -0.9 -0.7) (end -0.9 0.7) (layer "F.SilkS") (width 0.1016) (tstamp ba91dfe5-7b88-4bad-90a2-ce310100e66c))
|
|
(fp_line (start -0.9 0.7) (end 0.9 0.7) (layer "F.SilkS") (width 0.1016) (tstamp e7236952-13ef-42b6-97f0-9ffcef54b69b))
|
|
(fp_circle (center -1.2 0.5) (end -1.058582 0.5) (layer "F.SilkS") (width 0.1016) (fill none) (tstamp d376e2b9-6acd-48bb-87a6-34749103a6b1))
|
|
(pad "1" smd rect (at -0.675 0.4625) (size 0.25 0.275) (layers "F.Cu" "F.Paste" "F.Mask")
|
|
(solder_mask_margin 0.0635) (tstamp a3009c30-20f9-47fb-ab39-a43c911f6aaa))
|
|
(pad "2" smd rect (at -0.225 0.4625) (size 0.25 0.275) (layers "F.Cu" "F.Paste" "F.Mask")
|
|
(solder_mask_margin 0.0635) (tstamp 10c10e78-40d0-4176-ad30-b82e5220874d))
|
|
(pad "3" smd rect (at 0.225 0.4625) (size 0.25 0.275) (layers "F.Cu" "F.Paste" "F.Mask")
|
|
(solder_mask_margin 0.0635) (tstamp 519a1e8e-b3ab-4891-be15-1b3235dd3f52))
|
|
(pad "4" smd rect (at 0.675 0.4625) (size 0.25 0.275) (layers "F.Cu" "F.Paste" "F.Mask")
|
|
(solder_mask_margin 0.0635) (tstamp e855fa6d-c635-4a4b-8494-f371a41dd238))
|
|
(pad "5" smd rect (at 0.55 0 180) (size 0.5 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
|
|
(solder_mask_margin 0.0635) (tstamp 756ac60d-b59d-4608-885b-8336e78f11fc))
|
|
(pad "6" smd rect (at 0.675 -0.4625 180) (size 0.25 0.275) (layers "F.Cu" "F.Paste" "F.Mask")
|
|
(solder_mask_margin 0.0635) (tstamp c7ecf043-fc9b-4eb7-a5ea-3a0d137385e7))
|
|
(pad "7" smd rect (at 0.225 -0.4625 180) (size 0.25 0.275) (layers "F.Cu" "F.Paste" "F.Mask")
|
|
(solder_mask_margin 0.0635) (tstamp eadb5f8c-e1ee-4724-94cd-0721e759aebb))
|
|
(pad "8" smd rect (at -0.225 -0.4625 180) (size 0.25 0.275) (layers "F.Cu" "F.Paste" "F.Mask")
|
|
(solder_mask_margin 0.0635) (tstamp 38546f1e-26a1-4870-91f1-6f020dff712e))
|
|
(pad "9" smd rect (at -0.675 -0.4625 180) (size 0.25 0.275) (layers "F.Cu" "F.Paste" "F.Mask")
|
|
(solder_mask_margin 0.0635) (tstamp 78b23b6e-21c7-4ae1-89f1-879b1c0bb5fd))
|
|
(pad "10" smd rect (at -0.5 0) (size 0.6 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
|
|
(solder_mask_margin 0.0635) (tstamp 5a009c94-d100-4229-89f9-8805fe340837))
|
|
)
|