mirror of
https://github.com/oresat/oresat-c3-hardware.git
synced 2025-12-23 07:34:25 +00:00
09e19962c5
Added logo. Brought up to KiCAD 8.0.1. Added text next to smpm connectors. Fixed some 0.127 traces that didn't need to be that thin on nRESET. Fix silkscreen refdeses on new components. Move pin 1 marker on the BP0805A1308. Remove thermals on PA bottom layer. Added oresat-c3-eagle-import symbols and footprints so everything is local.
54 lines
2.9 KiB
Plaintext
54 lines
2.9 KiB
Plaintext
(footprint "BP0805" (version 20211014) (generator pcbnew)
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(layer "F.Cu")
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(tedit 0)
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(fp_text reference "REF**" (at 1.1 0) (layer "F.SilkS")
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(effects (font (size 0.51816 0.51816) (thickness 0.09144)) (justify left bottom))
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(tstamp 348eba2c-424b-4c65-8db7-bdbd2832d020)
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)
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(fp_text value "" (at 0 0) (layer "F.Fab")
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(effects (font (size 1.27 1.27) (thickness 0.15)))
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(tstamp 50b0424d-1a3a-43c5-912d-23eae08ff7c3)
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)
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(fp_poly (pts
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(xy -0.42 0.52)
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(xy -0.82 0.52)
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(xy -0.82 1.02)
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(xy -0.42 1.02)
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) (layer "F.Paste") (width 0) (fill solid) (tstamp 52e31a32-18fd-4e30-8eb9-c9df64a6e69f))
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(fp_poly (pts
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(xy 0.42 -0.52)
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(xy 0.82 -0.52)
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(xy 0.82 -1.02)
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) (layer "F.Paste") (width 0) (fill solid) (tstamp 75d9c16e-91b1-424a-ad26-2213c254ffe3))
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(fp_poly (pts
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(xy 0.82 0.52)
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(xy 0.42 0.52)
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) (layer "F.Paste") (width 0) (fill solid) (tstamp e82c6840-dfd7-4d2a-86d2-b4df5e3308f1))
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(fp_poly (pts
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) (layer "F.Paste") (width 0) (fill solid) (tstamp eeb704d0-da7b-45e3-a54f-3122af18e03e))
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(fp_line (start -0.2 1) (end 0.2 1) (layer "F.SilkS") (width 0.127) (tstamp 3c66ab3a-5c71-4d54-9c07-0cd4d9a755a9))
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(fp_line (start -0.8 -0.3) (end -0.8 0.3) (layer "F.SilkS") (width 0.127) (tstamp 3d1b4928-4cef-4da9-8610-943aeda38cce))
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(fp_line (start 0.8 -0.3) (end 0.8 0.3) (layer "F.SilkS") (width 0.127) (tstamp 6953a03f-1786-4c58-a63d-3ea4e8ed2eba))
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(fp_line (start -0.2 -1) (end 0.2 -1) (layer "F.SilkS") (width 0.127) (tstamp b317bb55-7560-475c-9491-579f849ee24d))
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(fp_circle (center -1.3 -1) (end -1.1 -1) (layer "F.SilkS") (width 0.127) (fill none) (tstamp f077b43f-c8a3-4db8-9218-d4f7bb8355a6))
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(fp_line (start -0.8 -1) (end -0.8 1) (layer "F.Fab") (width 0.127) (tstamp 0ac85c1e-6ab7-4a02-a1d9-777548700b84))
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(fp_line (start -0.8 1) (end 0.8 1) (layer "F.Fab") (width 0.127) (tstamp 16664260-4d61-4b2a-9bd4-76ae34f2480c))
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(fp_line (start 0.8 -1) (end -0.8 -1) (layer "F.Fab") (width 0.127) (tstamp 4772b09c-3bca-41f5-b8da-2a6af1bcbce6))
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(fp_line (start 0.8 1) (end 0.8 -1) (layer "F.Fab") (width 0.127) (tstamp 999c8ce0-0ed0-4ab3-b977-594ccd6f2671))
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(pad "1" smd rect (at -0.6 -0.775 180) (size 0.54 0.7) (layers "F.Cu" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp fb875f08-fbf4-4dde-b003-067a0543ba01))
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(pad "2" smd rect (at -0.6 0.775) (size 0.54 0.7) (layers "F.Cu" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 25bd6603-e70e-4a3b-b989-c0f41cb78f61))
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(pad "3" smd rect (at 0.6 0.775) (size 0.54 0.7) (layers "F.Cu" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 3474d966-1d0a-421f-929e-fd8c6e903a1e))
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(pad "4" smd rect (at 0.6 -0.775 180) (size 0.54 0.7) (layers "F.Cu" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 852d0be2-f97f-466b-9422-b63619fce8c2))
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)
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