mirror of
https://github.com/oresat/oresat-c3-hardware.git
synced 2025-12-22 23:34:08 +00:00
09e19962c5
Added logo. Brought up to KiCAD 8.0.1. Added text next to smpm connectors. Fixed some 0.127 traces that didn't need to be that thin on nRESET. Fix silkscreen refdeses on new components. Move pin 1 marker on the BP0805A1308. Remove thermals on PA bottom layer. Added oresat-c3-eagle-import symbols and footprints so everything is local.
40 lines
2.0 KiB
Plaintext
40 lines
2.0 KiB
Plaintext
(footprint "D_7343-31R" (version 20211014) (generator pcbnew)
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(layer "F.Cu")
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(tedit 0)
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(descr "<b>Chip Capacitor Type KEMET D / EIA 7343-21</b><p>\nKEMET V / EIA 7343-20, KEMET X / EIA 7343-43 Reflow solder")
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(fp_text reference "REF**" (at -3.65 -2.3) (layer "F.SilkS")
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(effects (font (size 1.1684 1.1684) (thickness 0.1016)) (justify left bottom))
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(tstamp 212a64ba-5e0a-4d33-8805-6cc5744e0eb9)
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)
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(fp_text value ">VALUE" (at -3.65 3.575) (layer "F.Fab")
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(effects (font (size 1.1684 1.1684) (thickness 0.1016)) (justify left bottom))
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(tstamp 3f04900d-119b-423e-9b11-dfac2c83d668)
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)
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(fp_line (start 3.45 -2.1) (end 3.45 2.1) (layer "F.Fab") (width 0.1016) (tstamp 4458e64c-39ae-4a23-b1b2-80fc595482e4))
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(fp_line (start -3.45 -2.1) (end 3.45 -2.1) (layer "F.Fab") (width 0.1016) (tstamp 5c3b9366-55d8-47a6-8f12-d708b1327528))
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(fp_line (start -3.45 2.1) (end -3.45 -2.1) (layer "F.Fab") (width 0.1016) (tstamp 72e78c5f-3add-4be7-aa58-fa6cd330d1d6))
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(fp_line (start 3.45 2.1) (end -3.45 2.1) (layer "F.Fab") (width 0.1016) (tstamp 7d551300-6f93-4fb9-87b4-32ce4eaa7968))
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(fp_poly (pts
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(xy 2.675 2.125)
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(xy 3.15 2.125)
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(xy 3.15 -2.125)
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(xy 2.675 -2.125)
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) (layer "F.Fab") (width 0) (fill solid) (tstamp 7f4ff370-a71d-4fa6-8f65-b9b9ffc39669))
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(fp_poly (pts
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(xy 3.5 1.2)
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(xy 3.65 1.2)
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(xy 3.65 -1.2)
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(xy 3.5 -1.2)
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) (layer "F.Fab") (width 0) (fill solid) (tstamp e4921b24-592a-46e3-ad9a-61d8b1a43c8d))
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(fp_poly (pts
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(xy -3.65 1.2)
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(xy -3.5 1.2)
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(xy -3.5 -1.2)
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(xy -3.65 -1.2)
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) (layer "F.Fab") (width 0) (fill solid) (tstamp f07f3473-d881-47a2-87c3-e81d5044110a))
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(pad "+" smd rect (at 3.175 0) (size 2.55 2.7) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp f7e32f1d-30ac-43e9-a60d-2b412e54a4df))
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(pad "-" smd rect (at -3.175 0) (size 2.55 2.7) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp b92b5ee2-8ab3-47f8-8e51-0dfd779cefd9))
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)
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