mirror of
https://github.com/oresat/oresat-c3-hardware.git
synced 2025-12-21 07:09:35 +00:00
09e19962c5
Added logo. Brought up to KiCAD 8.0.1. Added text next to smpm connectors. Fixed some 0.127 traces that didn't need to be that thin on nRESET. Fix silkscreen refdeses on new components. Move pin 1 marker on the BP0805A1308. Remove thermals on PA bottom layer. Added oresat-c3-eagle-import symbols and footprints so everything is local.
73 lines
4.5 KiB
Plaintext
73 lines
4.5 KiB
Plaintext
(footprint "FDMQ8203" (version 20211014) (generator pcbnew)
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(layer "F.Cu")
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(tedit 0)
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(descr "<b>MLP 4.5 x 5</b><br>\n")
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(fp_text reference "REF**" (at -2.54 -2.54) (layer "F.SilkS")
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(effects (font (size 0.508 0.508) (thickness 0.127)) (justify left bottom))
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(tstamp 3dd963f8-9e19-40c4-9fa3-a219424cd6ed)
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)
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(fp_text value ">VALUE" (at -2.54 3.81) (layer "F.Fab")
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(effects (font (size 0.508 0.508) (thickness 0.127)) (justify left bottom))
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(tstamp c28866d6-1f66-4c21-a690-62bd844ff5e5)
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)
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(fp_poly (pts
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(xy -2.1 -0.3)
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(xy -0.6 -0.3)
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(xy -0.6 -1.1)
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(xy -2.1 -1.1)
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) (layer "F.Paste") (width 0) (fill solid) (tstamp 0debf7a2-b9c6-4804-a1d2-e598967d0921))
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(fp_poly (pts
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(xy -2.1 1.1)
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(xy -0.6 1.1)
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(xy -0.6 0.3)
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(xy -2.1 0.3)
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) (layer "F.Paste") (width 0) (fill solid) (tstamp 2d4f85b0-4752-4a1f-9c53-3fe6f51b18de))
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(fp_poly (pts
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(xy 0.3 1.1)
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(xy 2 1.1)
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(xy 2 0.4)
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(xy 0.3 0.4)
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) (layer "F.Paste") (width 0) (fill solid) (tstamp 8af81dd6-fc7d-4e78-863c-aa75ac1cad63))
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(fp_poly (pts
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(xy 0.3 -0.4)
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(xy 2 -0.4)
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(xy 2 -1.1)
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(xy 0.3 -1.1)
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) (layer "F.Paste") (width 0) (fill solid) (tstamp 8cb64e6a-60d5-4c11-9b0b-0c2efc84cc4e))
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(fp_line (start 2.413 -1.4478) (end -2.413 -1.4478) (layer "F.SilkS") (width 0.127) (tstamp 1893a8bb-c565-4ada-9457-84ecc1f4de00))
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(fp_line (start -2.413 -1.4478) (end -2.413 1.4478) (layer "F.SilkS") (width 0.127) (tstamp 2829a27b-b76d-419b-8b6b-0fd29eb0b07b))
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(fp_line (start -2.413 1.4478) (end 2.413 1.4478) (layer "F.SilkS") (width 0.127) (tstamp b19a3064-ffb2-4a6e-bd69-22507e53cdd2))
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(fp_line (start 2.413 1.4478) (end 2.413 -1.4478) (layer "F.SilkS") (width 0.127) (tstamp cff70f66-320c-4d52-ae4c-3d2d7de95c53))
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(fp_circle (center -2.667 1.6764) (end -2.54 1.6764) (layer "F.SilkS") (width 0.127) (fill none) (tstamp 7aa87509-8c4e-494a-8e9d-66bbaae144d6))
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(pad "1" smd rect (at -2.024381 2.075434 90) (size 0.65 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp dbb83bf3-545b-431a-94e8-4509151a61ef))
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(pad "2" smd rect (at -1.211581 2.075434 90) (size 0.65 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp c0b85caf-7836-48a2-af91-860d719e94f8))
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(pad "3" smd rect (at -0.398781 2.075434 90) (size 0.65 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 0a65a1a5-746d-4c29-b20e-9e716c5e5386))
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(pad "4" smd rect (at 0.414018 2.075434 90) (size 0.65 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 4f97c5f8-713e-4154-bad3-1e1d5605d89b))
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(pad "5" smd rect (at 1.226818 2.075434 90) (size 0.65 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp dfd33b87-6fe4-414b-afd5-b1687b31717e))
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(pad "6" smd rect (at 2.039618 2.075434 90) (size 0.65 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp e4738197-6638-4265-aa7d-ee1ead777ef0))
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(pad "7" smd rect (at 2.039368 -2.075181 270) (size 0.65 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp ebecedb6-61f4-4e03-b4ce-6e9b2ad269c4))
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(pad "8" smd rect (at 1.226568 -2.075181 270) (size 0.65 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp aeb63392-2a8b-4448-8846-2b070dee4509))
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(pad "9" smd rect (at 0.413768 -2.075181 270) (size 0.65 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 380bde26-adb1-43d3-8463-90d2b8b8c890))
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(pad "10" smd rect (at -0.399031 -2.075181 270) (size 0.65 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 33cf2fef-cd85-48c9-a3c7-a408ae95a7c7))
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(pad "11" smd rect (at -1.211831 -2.075181 270) (size 0.65 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp cb18b8d0-d671-4766-bf1c-47386b8f0473))
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(pad "12" smd rect (at -2.024631 -2.075181 270) (size 0.65 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 3daa6f09-2c67-4c77-8d5e-4f625d3f475f))
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(pad "13" smd rect (at -1.334062 0) (size 1.78 2.5) (layers "F.Cu" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp a22ccc2e-41e6-429f-a1cc-07c388465688))
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(pad "14" smd rect (at 1.139696 0.750062) (size 2.17 1) (layers "F.Cu" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 676fa644-9249-4f32-a405-c19472362340))
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(pad "15" smd rect (at 1.140712 -0.752856) (size 2.17 1) (layers "F.Cu" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 3bce9a6e-f9c1-4820-8ab3-c2dbe9150eaa))
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)
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