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mirror of https://github.com/oresat/oresat-c3-hardware.git synced 2025-12-21 23:15:25 +00:00
oresat-c3-hardware/kicad/oresat-c3-eagle-import.pretty/QFP50P1600X1600X160-100N.kicad_mod
Andrew Greenberg 09e19962c5 Last changes to 6.1 after design review today.
Added logo.
Brought up to KiCAD 8.0.1.
Added text next to smpm connectors.
Fixed some 0.127 traces that didn't need to be that thin on nRESET.
Fix silkscreen refdeses on new components.
Move pin 1 marker on the BP0805A1308.
Remove thermals on PA bottom layer.
Added oresat-c3-eagle-import symbols and footprints so everything is local.
2024-03-31 17:23:32 -07:00

228 lines
19 KiB
Plaintext

(footprint "QFP50P1600X1600X160-100N" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 0)
(descr "<b>STM32F446VET6</b><br>\n")
(fp_text reference "REF**" (at -2.54 -3.81) (layer "F.SilkS")
(effects (font (size 0.32512 0.32512) (thickness 0.08128)) (justify left bottom))
(tstamp 82e3e98a-7608-4478-9f89-cf693dec3109)
)
(fp_text value ">VALUE" (at -2.54 -2.54) (layer "F.Fab")
(effects (font (size 0.32512 0.32512) (thickness 0.08128)) (justify left bottom))
(tstamp 22a9d565-52b4-4107-832d-8a0aaeee56f3)
)
(fp_line (start 6.65 6.65) (end -6.65 6.65) (layer "F.SilkS") (width 0.2) (tstamp 6bb3a7f8-45a6-4e4e-8d07-24257f7cbeb2))
(fp_line (start -6.65 -6.65) (end 6.65 -6.65) (layer "F.SilkS") (width 0.2) (tstamp 7144dd1e-7377-47fc-9314-bbdc03655f56))
(fp_line (start -6.65 6.65) (end -6.65 -6.65) (layer "F.SilkS") (width 0.2) (tstamp a091f336-2825-43a8-9c5c-d6752fea79a0))
(fp_line (start 6.65 -6.65) (end 6.65 6.65) (layer "F.SilkS") (width 0.2) (tstamp edc151fe-4381-462d-b157-ff53b8cfd83e))
(fp_circle (center -8.225 -6.75) (end -8.1 -6.75) (layer "F.SilkS") (width 0.25) (fill none) (tstamp 2e946220-ab06-4253-aa06-f3f168c65d17))
(fp_line (start 7 7) (end -7 7) (layer "F.Fab") (width 0.1) (tstamp 188572aa-cc7e-45c5-aa77-87bb446154bb))
(fp_line (start 7 -7) (end 7 7) (layer "F.Fab") (width 0.1) (tstamp 34b9c2a0-91fc-41a9-982b-a1f2a291e68e))
(fp_line (start -7 -7) (end 7 -7) (layer "F.Fab") (width 0.1) (tstamp 416dd959-a8af-4b3f-a773-45198254f40a))
(fp_line (start 8.725 -8.725) (end 8.725 8.725) (layer "F.Fab") (width 0.05) (tstamp 6961a8ed-82ef-4908-a607-cba03c6c9be8))
(fp_line (start -7 -6.5) (end -6.5 -7) (layer "F.Fab") (width 0.1) (tstamp 69aac4de-2c49-4a29-bfa3-428af53ff346))
(fp_line (start -7 7) (end -7 -7) (layer "F.Fab") (width 0.1) (tstamp 7508f3c6-783c-4a03-908d-2774856dd551))
(fp_line (start 8.725 8.725) (end -8.725 8.725) (layer "F.Fab") (width 0.05) (tstamp 7f661934-acfa-48e5-b7be-c71f034ed8ef))
(fp_line (start -8.725 8.725) (end -8.725 -8.725) (layer "F.Fab") (width 0.05) (tstamp aff3b298-ab66-4bd7-ac31-11281342b530))
(fp_line (start -8.725 -8.725) (end 8.725 -8.725) (layer "F.Fab") (width 0.05) (tstamp b3540766-d71c-46cc-8ccf-5dc270cc5325))
(pad "1" smd rect (at -7.738 -6) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 928d2ed0-a2f9-4c13-b76a-144a982478bd))
(pad "2" smd rect (at -7.738 -5.5) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp b776f9cd-8241-4c62-a5e7-68e432c9bc7c))
(pad "3" smd rect (at -7.738 -5) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp eb0c6164-976a-405e-8378-161571af683e))
(pad "4" smd rect (at -7.738 -4.5) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 8ef9ce94-8789-4fb1-a2c0-7a94dcd8b1fd))
(pad "5" smd rect (at -7.738 -4) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 849de6ba-d494-4c78-9244-520dac2bf5a8))
(pad "6" smd rect (at -7.738 -3.5) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 8e54afca-36dc-4931-b5ff-afcbfad72b98))
(pad "7" smd rect (at -7.738 -3) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 7b5cc042-2cce-47c3-8567-0c09bea5dea2))
(pad "8" smd rect (at -7.738 -2.5) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp a63a99fa-1ad4-4cc5-b42b-7479ebe63bb0))
(pad "9" smd rect (at -7.738 -2) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp b776185f-50d4-4dd7-95ca-07ac0ca21351))
(pad "10" smd rect (at -7.738 -1.5) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp f4240368-b8d5-4c1d-9c44-913269f5397f))
(pad "11" smd rect (at -7.738 -1) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp bd850208-f7b5-4611-9504-8b0f4cd2978e))
(pad "12" smd rect (at -7.738 -0.5) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp a9c98872-50ca-4007-ad4b-8e1175d66f35))
(pad "13" smd rect (at -7.738 0) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 8790f044-6354-4c81-9053-98284b4fe21d))
(pad "14" smd rect (at -7.738 0.5) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp f62d3d1d-c9b5-4f62-8df3-1ef2aa068c57))
(pad "15" smd rect (at -7.738 1) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 7dc88a42-7568-497e-9c98-641b6fdf7329))
(pad "16" smd rect (at -7.738 1.5) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp bd06ec2d-fd7d-46b7-af61-56796e46c933))
(pad "17" smd rect (at -7.738 2) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 671f1201-9565-436d-be2d-441cd7d80adb))
(pad "18" smd rect (at -7.738 2.5) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 52ea1b8a-f9c1-4362-9e2e-43babb52a160))
(pad "19" smd rect (at -7.738 3) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp e3381be9-6e2b-4079-8855-f2304d82c9df))
(pad "20" smd rect (at -7.738 3.5) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 813fbe7b-c4e1-4afc-8f7b-86e8a971535d))
(pad "21" smd rect (at -7.738 4) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 072afb33-8210-44f0-84bc-17833aca8baf))
(pad "22" smd rect (at -7.738 4.5) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 2c6f35a2-4802-4777-9551-204ad9cdd226))
(pad "23" smd rect (at -7.738 5) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp e2df20dd-9c84-4b2a-be6a-b43fcb2372d8))
(pad "24" smd rect (at -7.738 5.5) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 80c09670-68e1-41a9-98e5-957d50b8b0b2))
(pad "25" smd rect (at -7.738 6) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 9bd64fa8-ab2a-48df-a188-1283813f3fbc))
(pad "26" smd rect (at -6 7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp c87f6df9-5904-4ffa-90cf-4bd0db56c3dc))
(pad "27" smd rect (at -5.5 7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 19db3ad5-2869-4f77-b01e-f039d195b7ab))
(pad "28" smd rect (at -5 7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 54870c11-032a-4d03-9515-2a65c7c27263))
(pad "29" smd rect (at -4.5 7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 783f8c0c-0415-48ef-bd99-8a6bba212be5))
(pad "30" smd rect (at -4 7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 88916d09-c609-4a3a-bacd-d2bdcde38254))
(pad "31" smd rect (at -3.5 7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp c2d5493d-2a96-4d7f-8b01-301050ad1a1f))
(pad "32" smd rect (at -3 7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 34034523-e72b-49e9-8011-ef13ad5d2e86))
(pad "33" smd rect (at -2.5 7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 59b5c04b-dfb1-4b14-817e-1cc4d259b071))
(pad "34" smd rect (at -2 7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 7279c2b3-184e-44f1-94f2-8e579badf43f))
(pad "35" smd rect (at -1.5 7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp aac23312-915e-4064-b5b0-3c963291afef))
(pad "36" smd rect (at -1 7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp fbc51dbd-1a2a-474d-a2bd-ecb0c265ecde))
(pad "37" smd rect (at -0.5 7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 92d30eb9-7124-4e85-ae97-12987dbc12cb))
(pad "38" smd rect (at 0 7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 3228375b-3f82-483c-9743-8392bbc6d3eb))
(pad "39" smd rect (at 0.5 7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp eb5f67b5-129f-4cc9-bf49-6040f5fe8b4a))
(pad "40" smd rect (at 1 7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 9c51369a-b9f4-4219-8997-7b477fe7c5df))
(pad "41" smd rect (at 1.5 7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 9692eb68-0264-465c-b45e-003884edea14))
(pad "42" smd rect (at 2 7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp a2562bd9-d896-48f4-bf4e-1707e995748f))
(pad "43" smd rect (at 2.5 7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 62d36aea-949a-4a1c-8983-cd587fc9ee29))
(pad "44" smd rect (at 3 7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 7d461fae-9a7a-4ccb-bb2f-6453eed24a5d))
(pad "45" smd rect (at 3.5 7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp bf7c76f9-c7d1-40de-816e-7afd0870dbe4))
(pad "46" smd rect (at 4 7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 4ba1a779-1c60-42fa-9c47-fd993e19271e))
(pad "47" smd rect (at 4.5 7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 87a6fd60-cee0-42f8-84e4-2bfcbcb7668f))
(pad "48" smd rect (at 5 7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp b7ab1141-3ac5-440e-8f49-95a99bc099a0))
(pad "49" smd rect (at 5.5 7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 3103ad6f-5db3-444f-a48d-931e4c6c28b5))
(pad "50" smd rect (at 6 7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 3c9042a1-92d1-40d7-a3af-49e95ae9a9fb))
(pad "51" smd rect (at 7.738 6) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 3e1af021-4cca-44c2-b6ae-cf5aca442d88))
(pad "52" smd rect (at 7.738 5.5) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp cf9fc862-82d3-49d8-8d62-e023eca4fb1b))
(pad "53" smd rect (at 7.738 5) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp fa38bb2c-eb98-4248-bb34-708a9b1cee47))
(pad "54" smd rect (at 7.738 4.5) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp b28ebbd9-6916-4f1e-98a4-54f50fd0fd3f))
(pad "55" smd rect (at 7.738 4) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp e7806681-f5ce-4e7c-be7d-f19de7adb836))
(pad "56" smd rect (at 7.738 3.5) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 4bc0bec1-6732-430f-a464-f8218f6a8414))
(pad "57" smd rect (at 7.738 3) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 4249e884-38ef-4dd5-b9de-4a5aacc23f1c))
(pad "58" smd rect (at 7.738 2.5) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 7c5b89bb-4ff0-4e2a-b3c5-d7f3278f7c89))
(pad "59" smd rect (at 7.738 2) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp a47d7221-c568-4d3b-80d9-fd6e7afd93a0))
(pad "60" smd rect (at 7.738 1.5) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 6f6ca8de-5426-4eb3-ae1b-b660e4adf09d))
(pad "61" smd rect (at 7.738 1) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp dbced8fe-963e-4ed8-ade0-143b4a8ef741))
(pad "62" smd rect (at 7.738 0.5) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 72f72ba8-a32f-4bd3-8fe4-4aae9ab19dda))
(pad "63" smd rect (at 7.738 0) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp a25a9551-8fdd-4cd5-9c6f-f42cc27cc608))
(pad "64" smd rect (at 7.738 -0.5) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 6c5eef21-b613-4714-a7d5-4bb556d71f74))
(pad "65" smd rect (at 7.738 -1) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 5d57fdcf-7c23-4fb0-8dea-17bdc2acde54))
(pad "66" smd rect (at 7.738 -1.5) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp e6cf9deb-f9db-49f1-b37f-6657e10b07fe))
(pad "67" smd rect (at 7.738 -2) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp d89bd418-1716-474d-a09e-9633d8c94619))
(pad "68" smd rect (at 7.738 -2.5) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 1dd8d4a1-8240-4dad-9f23-f7a3ba282311))
(pad "69" smd rect (at 7.738 -3) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 84e85b11-c01d-4758-a174-dfaff3f48015))
(pad "70" smd rect (at 7.738 -3.5) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 37ce0a68-c72e-4d7a-90ea-762c827690dc))
(pad "71" smd rect (at 7.738 -4) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 64bc59b3-3ab0-452b-a7d3-1d792f3e1e1e))
(pad "72" smd rect (at 7.738 -4.5) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 78e4de5f-a373-4ebf-b80d-b70352f13376))
(pad "73" smd rect (at 7.738 -5) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 3af214da-30c4-4b60-b2cf-aaccf4d4c08d))
(pad "74" smd rect (at 7.738 -5.5) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 20ba4eca-1094-4c7d-a572-1e595f47ade1))
(pad "75" smd rect (at 7.738 -6) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 51b659c1-3d35-4f7a-82bd-d1ef48ba8e38))
(pad "76" smd rect (at 6 -7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp d6e1080d-f5bd-463d-8589-442af58126e9))
(pad "77" smd rect (at 5.5 -7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 54cfac85-b396-4df6-bb11-758437dda913))
(pad "78" smd rect (at 5 -7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp a4d0f20d-0c96-4963-99af-d2f1c27d8221))
(pad "79" smd rect (at 4.5 -7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 663382b9-5b91-41da-b5f3-dc8e9ffafbf9))
(pad "80" smd rect (at 4 -7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp d2771b49-73ee-4999-b849-1567bfa68b47))
(pad "81" smd rect (at 3.5 -7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp ed460d3b-8a2e-40f4-a1ac-a0b9e56c4a65))
(pad "82" smd rect (at 3 -7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 56c83ed3-9b02-47e3-a47e-eb5d204ecb1e))
(pad "83" smd rect (at 2.5 -7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp b8fd2fd3-fd7a-4959-bee7-98206f57eb4c))
(pad "84" smd rect (at 2 -7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp e92e372c-a821-4160-9014-f1df82f4d159))
(pad "85" smd rect (at 1.5 -7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp ef9134f6-db5d-4eb1-b387-e5d595fc7d05))
(pad "86" smd rect (at 1 -7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 8d3828e8-2d46-4f9a-b1d2-bea6804f7426))
(pad "87" smd rect (at 0.5 -7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp d0504dc4-1eaa-42ec-ab44-2b2696d4cd74))
(pad "88" smd rect (at 0 -7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp b3687388-e6c0-454a-97bd-af87b5f8ada4))
(pad "89" smd rect (at -0.5 -7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 50797ee1-41a4-4507-a0b5-6bf5fd6c9c1b))
(pad "90" smd rect (at -1 -7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 16b22bbd-5e2e-494b-be3f-3f692604b099))
(pad "91" smd rect (at -1.5 -7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 5c75559e-241c-4ff6-9e56-fd5b833a2c1d))
(pad "92" smd rect (at -2 -7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 57508c31-6ae8-4eb4-b817-72ca41fecded))
(pad "93" smd rect (at -2.5 -7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp ddde530f-d2b3-4970-a8f4-b6d21fe250d9))
(pad "94" smd rect (at -3 -7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 4f5cde8e-944d-43d6-b1e1-54a669142298))
(pad "95" smd rect (at -3.5 -7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp adaf2329-28f8-42a7-a6f8-1bce0e4b4c2b))
(pad "96" smd rect (at -4 -7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 6ee2024d-469f-46b7-b517-f8e2c568b4f6))
(pad "97" smd rect (at -4.5 -7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp c54a00f0-0297-4e29-ac85-674a42311d1d))
(pad "98" smd rect (at -5 -7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 677ae305-d9a3-45f0-bc42-cbd245c2d4bd))
(pad "99" smd rect (at -5.5 -7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 51b821d6-2c79-4e35-87ad-4207f00a394e))
(pad "100" smd rect (at -6 -7.738 90) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 99fba636-76c5-4391-90e8-b4056ac55838))
)