mirror of
https://github.com/oresat/oresat-c3-hardware.git
synced 2025-12-21 07:09:35 +00:00
09e19962c5
Added logo. Brought up to KiCAD 8.0.1. Added text next to smpm connectors. Fixed some 0.127 traces that didn't need to be that thin on nRESET. Fix silkscreen refdeses on new components. Move pin 1 marker on the BP0805A1308. Remove thermals on PA bottom layer. Added oresat-c3-eagle-import symbols and footprints so everything is local.
36 lines
2.6 KiB
Plaintext
36 lines
2.6 KiB
Plaintext
(footprint "QPC1022" (version 20211014) (generator pcbnew)
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(layer "F.Cu")
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(tedit 0)
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(fp_text reference "REF**" (at -0.91694 -0.962659) (layer "F.SilkS")
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(effects (font (size 0.23368 0.23368) (thickness 0.02032)) (justify left bottom))
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(tstamp 3ed50f7b-13eb-4a74-aee5-d0e611e912c2)
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)
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(fp_text value ">VALUE" (at -0.989331 1.172209) (layer "F.Fab")
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(effects (font (size 0.23368 0.23368) (thickness 0.02032)) (justify left bottom))
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(tstamp 44c5d65e-3631-42f5-aaee-adb55d057ce1)
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)
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(fp_line (start -0.55 0.75) (end -0.55 -0.75) (layer "F.SilkS") (width 0.0762) (tstamp 1f93fa36-2ddc-499b-9730-df8bd3e97ab4))
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(fp_line (start 0.55 0.75) (end -0.55 0.75) (layer "F.SilkS") (width 0.0762) (tstamp 283ae39b-b91f-492e-8a4c-95fd32818ce3))
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(fp_line (start -0.55 -0.75) (end 0.55 -0.75) (layer "F.SilkS") (width 0.0762) (tstamp b10e3078-b78d-497b-9e80-b15532c1e937))
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(fp_line (start 0.55 -0.75) (end 0.55 0.75) (layer "F.SilkS") (width 0.0762) (tstamp d58c0a67-2db9-417e-ab43-2de98bcee059))
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(fp_circle (center -0.75 -0.55) (end -0.7 -0.55) (layer "F.SilkS") (width 0.0762) (fill none) (tstamp b30cd43b-ff26-4038-957e-1b861ede63c2))
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(pad "1" smd rect (at -0.4 -0.4 90) (size 0.2 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp bf565800-4941-46c3-9b52-57c920ddfdf9))
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(pad "2" smd rect (at -0.4 0 90) (size 0.2 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 4739c8e7-9d98-4858-8165-e8ec64683257))
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(pad "3" smd rect (at -0.4 0.4 90) (size 0.2 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 85ccb1ea-c506-409d-8d45-e469c383b5c0))
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(pad "4" smd rect (at 0 0.6 90) (size 0.2 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp d096bd8d-8dcf-4b13-a828-2903d93501f9))
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(pad "5" smd rect (at 0.4 0.4 90) (size 0.2 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 45464935-d4ac-40d2-8c1c-09411209681b))
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(pad "6" smd rect (at 0.4 0 90) (size 0.2 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp bb29f81b-7b73-4275-940d-cb628b6e1727))
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(pad "7" smd rect (at 0.4 -0.4 90) (size 0.2 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp ef234da1-4986-4c6f-8835-9597c00f5f16))
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(pad "8" smd rect (at 0 -0.6 90) (size 0.2 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp d192e9fb-f3f8-4c15-b6e0-749ab73b1cc3))
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(pad "9" smd rect (at 0 0 90) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 0255785c-a37f-46c2-b6d2-51aecb2e9643))
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)
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