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mirror of https://github.com/oresat/oresat-c3-hardware.git synced 2025-12-21 23:15:25 +00:00
Andrew Greenberg 09e19962c5 Last changes to 6.1 after design review today.
Added logo.
Brought up to KiCAD 8.0.1.
Added text next to smpm connectors.
Fixed some 0.127 traces that didn't need to be that thin on nRESET.
Fix silkscreen refdeses on new components.
Move pin 1 marker on the BP0805A1308.
Remove thermals on PA bottom layer.
Added oresat-c3-eagle-import symbols and footprints so everything is local.
2024-03-31 17:23:32 -07:00

63 lines
3.4 KiB
Plaintext

(footprint "SC70-5" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 0)
(descr "<b>SMT SC70-5</b><p>\nSOT353 - Philips Semiconductors<br>\nSource: http://www.semiconductors.philips.com/acrobat_download/datasheets/74HC_HCT1G66_3.pdf")
(fp_text reference "REF**" (at 1.27 1.27) (layer "F.SilkS")
(effects (font (size 0.508 0.508) (thickness 0.127)) (justify left bottom))
(tstamp cf681ef9-7dde-4494-9fa2-da207a83520d)
)
(fp_text value "" (at 0 0) (layer "F.Fab")
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)
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(fp_circle (center -1.4 0.9) (end -1.2 0.9) (layer "F.SilkS") (width 0.127) (fill none) (tstamp c9747dc7-d203-4566-96db-e708b6f20e70))
(fp_line (start -1 0.55) (end -1 0.3) (layer "F.Fab") (width 0.127) (tstamp 3e0a68b3-7dc2-4e03-8dcd-d2e1f9efff3c))
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(pad "1" smd rect (at -0.65 0.85) (size 0.4 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (tstamp 6fb3da75-b1e2-4f10-b542-06dc18c7ac93))
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