mirror of
https://github.com/oresat/oresat-c3-hardware.git
synced 2025-12-21 07:09:35 +00:00
09e19962c5
Added logo. Brought up to KiCAD 8.0.1. Added text next to smpm connectors. Fixed some 0.127 traces that didn't need to be that thin on nRESET. Fix silkscreen refdeses on new components. Move pin 1 marker on the BP0805A1308. Remove thermals on PA bottom layer. Added oresat-c3-eagle-import symbols and footprints so everything is local.
66 lines
4.3 KiB
Plaintext
66 lines
4.3 KiB
Plaintext
(footprint "SO-POWERPAD-8" (version 20211014) (generator pcbnew)
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(layer "F.Cu")
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(tedit 0)
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(fp_text reference "REF**" (at -3.144518 -4.262118) (layer "F.SilkS")
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(effects (font (size 1.1684 1.1684) (thickness 0.1016)) (justify left bottom))
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(tstamp 369034d9-49e1-4d5c-bf3d-5d88fb366e77)
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)
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(fp_text value ">VALUE" (at -3.2766 5.3594) (layer "F.Fab")
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(effects (font (size 1.1684 1.1684) (thickness 0.1016)) (justify left bottom))
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(tstamp 448eb666-f06f-415b-a6cd-4e20573705c8)
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)
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(fp_poly (pts
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(xy 0.127 -0.127)
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(xy 1.397 -0.127)
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(xy 1.397 -1.016)
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(xy 0.127 -1.016)
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) (layer "F.Paste") (width 0) (fill solid) (tstamp 564a4835-3c67-447a-86fa-159b5e64cbc6))
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(fp_poly (pts
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(xy -1.397 -0.127)
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(xy -0.127 -0.127)
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(xy -0.127 -1.016)
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(xy -1.397 -1.016)
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) (layer "F.Paste") (width 0) (fill solid) (tstamp 63df38a0-b83a-48cf-b296-93e44f8147d1))
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(fp_poly (pts
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(xy 0.127 1.016)
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(xy 1.397 1.016)
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(xy 1.397 0.127)
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(xy 0.127 0.127)
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) (layer "F.Paste") (width 0) (fill solid) (tstamp 9d8b8cd4-eb9b-44ea-a642-d458d4159eb0))
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(fp_poly (pts
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(xy -1.397 1.016)
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(xy -0.127 1.016)
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(xy -0.127 0.127)
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(xy -1.397 0.127)
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) (layer "F.Paste") (width 0) (fill solid) (tstamp d6272b13-ac1d-42cf-af36-f716ca99ec05))
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(fp_line (start -2.499359 -1.99644) (end -2.499359 1.99644) (layer "F.SilkS") (width 0.127) (tstamp 09c5b746-b7ec-44e4-8e88-1cb098909ecd))
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(fp_line (start 2.499359 -1.99644) (end 2.499359 1.99644) (layer "F.SilkS") (width 0.127) (tstamp 54d65d4f-bb85-45f0-b40a-536b0d270857))
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(fp_line (start 0.960118 -1.99644) (end 1.5748 -1.99644) (layer "F.SilkS") (width 0.127) (tstamp 5d6c921f-7e09-4df3-a706-509c418468b8))
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(fp_line (start -0.299718 -1.99644) (end 0.299718 -1.99644) (layer "F.SilkS") (width 0.127) (tstamp acb3c335-5e21-4a32-b272-cb91c08f18b0))
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(fp_line (start -1.579881 -1.99644) (end -0.9652 -1.99644) (layer "F.SilkS") (width 0.127) (tstamp c75a6e3d-f458-4540-894e-2c9e59a278f0))
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(fp_circle (center -3.048 1.905) (end -2.868397 1.905) (layer "F.SilkS") (width 0.127) (fill none) (tstamp 4543752a-1992-4aa9-8ec3-80113aa2d62f))
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(fp_circle (center -2.09804 3.90144) (end -2.073944 3.90144) (layer "F.SilkS") (width 0.048193) (fill solid) (tstamp eb4cc790-2d96-4df4-920d-202ec6d0f52f))
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(fp_line (start 2.499359 1.99644) (end -2.499359 1.99644) (layer "F.Fab") (width 0.127) (tstamp 25c9f048-8d82-44ae-b22d-a4c387ecb70c))
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(fp_line (start 2.499359 -1.99644) (end 2.499359 1.99644) (layer "F.Fab") (width 0.127) (tstamp 73b5f613-30d1-4912-8796-851d9fc25d47))
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(fp_line (start -2.499359 -1.99644) (end 2.499359 -1.99644) (layer "F.Fab") (width 0.127) (tstamp 7d025de1-4beb-4838-b387-78a0a8597197))
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(fp_line (start -2.499359 1.99644) (end -2.499359 -1.99644) (layer "F.Fab") (width 0.127) (tstamp f80f58ce-a2c0-4354-9b68-74acde4b48a8))
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(pad "1" smd rect (at -1.905 2.875 90) (size 2.2 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp eada37c7-6aa7-476a-97be-16b8915b8d19))
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(pad "2" smd rect (at -0.635 2.875 90) (size 2.2 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 127cde23-f5b3-49f4-a396-e3b1f7eca4c9))
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(pad "3" smd rect (at 0.635 2.875 90) (size 2.2 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp afed325d-fc06-47c3-b307-4d3f337fbbaa))
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(pad "4" smd rect (at 1.905 2.875 90) (size 2.2 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 5b393d1d-981d-4290-9e5f-63bd9b2ca667))
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(pad "5" smd rect (at 1.905 -2.875 90) (size 2.2 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 155fb8bd-b7fe-4907-8861-e473f1f0f5e5))
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(pad "6" smd rect (at 0.635 -2.875 90) (size 2.2 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 2dfd3135-6b66-4cd8-90c6-48c64ed025fa))
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(pad "7" smd rect (at -0.635 -2.875 90) (size 2.2 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp c5e31508-bfcc-459d-aacb-7df92ee78180))
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(pad "8" smd rect (at -1.905 -2.875 90) (size 2.2 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 69057c7d-c7c7-4aea-b721-e9596ae8b9a9))
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(pad "THERMAL" smd rect (at 0 0 180) (size 3.1 2.4) (layers "F.Cu" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp e17d0551-a075-4aa0-8c0c-573296f1f734))
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)
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