mirror of
https://github.com/oresat/oresat-c3-hardware.git
synced 2025-12-22 15:25:23 +00:00
09e19962c5
Added logo. Brought up to KiCAD 8.0.1. Added text next to smpm connectors. Fixed some 0.127 traces that didn't need to be that thin on nRESET. Fix silkscreen refdeses on new components. Move pin 1 marker on the BP0805A1308. Remove thermals on PA bottom layer. Added oresat-c3-eagle-import symbols and footprints so everything is local.
53 lines
4.4 KiB
Plaintext
53 lines
4.4 KiB
Plaintext
(footprint "SOP65P640X120-14N" (version 20211014) (generator pcbnew)
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(layer "F.Cu")
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(tedit 0)
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(descr "14-SOP, 0.65 mm pitch, 6.40 mm span, 5.00 X 4.40 X 1.20 mm body\n<p>14-pin SOP package with 0.65 mm pitch, 6.40 mm span with body size 5.00 X 4.40 X 1.20 mm</p>")
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(fp_text reference "REF**" (at 0 -3.5424) (layer "F.SilkS")
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(effects (font (size 1.1684 1.1684) (thickness 0.1016)) (justify bottom))
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(tstamp 44ea8e87-6e91-4190-828e-519596747854)
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)
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(fp_text value ">VALUE" (at 0 3.185) (layer "F.Fab")
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(effects (font (size 1.1684 1.1684) (thickness 0.1016)) (justify top))
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(tstamp 3b317a52-5baa-42ca-a19e-8f7d6c14cc7e)
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)
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(fp_line (start 2.25 2.55) (end 2.25 2.4074) (layer "F.SilkS") (width 0.12) (tstamp 0b4f7472-67e3-4795-9731-09f2aba46804))
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(fp_line (start -2.25 2.4074) (end -2.25 2.55) (layer "F.SilkS") (width 0.12) (tstamp 1c5fc603-02a5-44e2-9fa3-7a94ae569d38))
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(fp_line (start 2.25 -2.55) (end 2.25 -2.4074) (layer "F.SilkS") (width 0.12) (tstamp 571626ce-b491-4433-9218-805814cc2273))
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(fp_line (start -2.25 2.55) (end 2.25 2.55) (layer "F.SilkS") (width 0.12) (tstamp 8376f20f-02d4-4d97-8386-f4353816e4c4))
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(fp_line (start -2.25 -2.55) (end 2.25 -2.55) (layer "F.SilkS") (width 0.12) (tstamp c4915e2b-6a5d-457d-a7c3-492eded701cb))
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(fp_line (start -2.25 -2.4074) (end -2.25 -2.55) (layer "F.SilkS") (width 0.12) (tstamp fbbc6990-6acb-406a-9d88-a1272c1589a6))
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(fp_circle (center -2.9538 -2.6574) (end -2.8288 -2.6574) (layer "F.SilkS") (width 0.25) (fill solid) (tstamp eb886ba8-8e01-4b38-9e16-ced4f455c13d))
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(fp_line (start -2.25 2.55) (end -2.25 -2.55) (layer "F.Fab") (width 0.12) (tstamp 4f5af097-cfb1-4a53-9b7b-ed32295aed89))
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(fp_line (start 2.25 -2.55) (end 2.25 2.55) (layer "F.Fab") (width 0.12) (tstamp 70b9fcc4-f2d6-4841-a726-ef8eb5316dfa))
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(fp_line (start -2.25 -2.55) (end 2.25 -2.55) (layer "F.Fab") (width 0.12) (tstamp e0adb22a-12ce-404e-a490-37a85c5b0304))
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(fp_line (start 2.25 2.55) (end -2.25 2.55) (layer "F.Fab") (width 0.12) (tstamp e95358e3-7a7d-4913-a973-d29ec4f0fc05))
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(pad "1" smd rect (at -2.8717 -1.95) (size 1.5719 0.4068) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp c8b1bda8-7e49-4efc-b361-45a7c12046b0))
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(pad "2" smd rect (at -2.8717 -1.3) (size 1.5719 0.4068) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 877730aa-61f5-4eda-94ad-91dc6143ab25))
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(pad "3" smd rect (at -2.8717 -0.65) (size 1.5719 0.4068) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 4e42775c-75b3-4b57-b6be-41e5aa954d6d))
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(pad "4" smd rect (at -2.8717 0) (size 1.5719 0.4068) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp f4fd2b78-df3f-4b36-8a60-28a776a3f857))
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(pad "5" smd rect (at -2.8717 0.65) (size 1.5719 0.4068) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 7f73545a-c803-46a5-a16d-f4efb187d722))
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(pad "6" smd rect (at -2.8717 1.3) (size 1.5719 0.4068) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 5b48c3ef-a08d-4e21-9fb5-74cb3adb0236))
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(pad "7" smd rect (at -2.8717 1.95) (size 1.5719 0.4068) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 3f2b9ee8-3db9-47be-8f34-5f4d07e1332a))
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(pad "8" smd rect (at 2.8717 1.95) (size 1.5719 0.4068) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp d3f00c4c-e35d-4bde-a6b9-d864e425405e))
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(pad "9" smd rect (at 2.8717 1.3) (size 1.5719 0.4068) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 4e22e9f0-60d8-4c85-8680-cf2549c2d7ff))
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(pad "10" smd rect (at 2.8717 0.65) (size 1.5719 0.4068) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp ed91b885-dfef-43c2-b47e-c813ed4ec777))
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(pad "11" smd rect (at 2.8717 0) (size 1.5719 0.4068) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 999e5788-71ea-497a-ab7f-81f4587ed53b))
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(pad "12" smd rect (at 2.8717 -0.65) (size 1.5719 0.4068) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 5031984e-2ede-4979-b116-419014b58e27))
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(pad "13" smd rect (at 2.8717 -1.3) (size 1.5719 0.4068) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp e1fb8384-7a15-47de-8132-6490f2a71b75))
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(pad "14" smd rect (at 2.8717 -1.95) (size 1.5719 0.4068) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp ea5c06cb-7a3a-466c-b069-f28f5a713867))
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)
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