mirror of
https://github.com/oresat/oresat-c3-hardware.git
synced 2025-12-23 07:34:25 +00:00
09e19962c5
Added logo. Brought up to KiCAD 8.0.1. Added text next to smpm connectors. Fixed some 0.127 traces that didn't need to be that thin on nRESET. Fix silkscreen refdeses on new components. Move pin 1 marker on the BP0805A1308. Remove thermals on PA bottom layer. Added oresat-c3-eagle-import symbols and footprints so everything is local.
37 lines
2.8 KiB
Plaintext
37 lines
2.8 KiB
Plaintext
(footprint "SOT23-8_TI-DCN" (version 20211014) (generator pcbnew)
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(layer "F.Cu")
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(tedit 0)
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(fp_text reference "REF**" (at 1.9 -0.2) (layer "F.SilkS")
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(effects (font (size 0.508 0.508) (thickness 0.127)) (justify left bottom))
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(tstamp 1ccf1458-4fd2-49c1-bc84-480f4b22333a)
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)
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(fp_text value ">VALUE" (at 1.9 0.7) (layer "F.Fab")
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(effects (font (size 0.508 0.508) (thickness 0.127)) (justify left bottom))
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(tstamp 45aeb501-3364-440c-8959-2143a604bded)
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)
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(fp_line (start 1.5 -0.9) (end 1.5 0.9) (layer "F.SilkS") (width 0.127) (tstamp 38fc4d42-73f5-4095-9d2a-8a20e5b80a49))
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(fp_line (start -1.5 -0.9) (end -1.5 0.9) (layer "F.SilkS") (width 0.127) (tstamp 9e4a1ee1-3c48-4cf9-b64a-56357ae6a3ba))
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(fp_arc (start -1.524 -0.254) (mid -1.27 0) (end -1.524 0.254) (layer "F.SilkS") (width 0.127) (tstamp 3766277c-09cc-49b8-8b0f-1e7e84208cac))
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(fp_circle (center -1.651 1.397) (end -1.524 1.397) (layer "F.SilkS") (width 0.254) (fill none) (tstamp 12533e13-bb9b-4a43-ad51-d6f04f528785))
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(fp_line (start -1.5 0.9) (end 1.5 0.9) (layer "F.Fab") (width 0.1) (tstamp 01d8fb69-35bf-45c2-af09-b0a0e269d331))
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(fp_line (start -1.5 -0.9) (end -1.5 0.9) (layer "F.Fab") (width 0.1) (tstamp 2398d741-b067-4269-b0ab-7613cc8db480))
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(fp_line (start 1.5 -0.9) (end -1.5 -0.9) (layer "F.Fab") (width 0.1) (tstamp 58b8dfd4-50e1-41b8-952d-c3932c2a9f50))
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(fp_line (start 1.5 0.9) (end 1.5 -0.9) (layer "F.Fab") (width 0.1) (tstamp ed1db705-a919-4111-9338-ab986274b50a))
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(pad "1" smd rect (at -0.975 1.3 90) (size 1.1 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp d4f039b6-a39f-4d5b-aa80-3ce9c920eeb6))
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(pad "2" smd rect (at -0.325 1.3 90) (size 1.1 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 642a5988-872f-4087-8a21-cf83c0df073d))
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(pad "3" smd rect (at 0.325 1.3 90) (size 1.1 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 23d8303e-263c-4a28-95b6-d004a64e304a))
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(pad "4" smd rect (at 0.975 1.3 90) (size 1.1 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp ef247ad6-f0e3-47f3-91fb-ec1c67f1fa99))
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(pad "5" smd rect (at 0.975 -1.3 90) (size 1.1 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp fc066b60-db02-4378-9ffc-18382dc21418))
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(pad "6" smd rect (at 0.325 -1.3 90) (size 1.1 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 39160624-6ca4-4fe4-b611-4148af6277c3))
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(pad "7" smd rect (at -0.325 -1.3 90) (size 1.1 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 6d2eb41b-c143-4540-9129-b88ec5b9daa6))
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(pad "8" smd rect (at -0.975 -1.3 90) (size 1.1 0.45) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 6dd5317a-5ab7-45a5-b664-2a6790b30549))
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)
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