mirror of
https://github.com/oresat/oresat-c3-hardware.git
synced 2025-12-23 07:34:25 +00:00
09e19962c5
Added logo. Brought up to KiCAD 8.0.1. Added text next to smpm connectors. Fixed some 0.127 traces that didn't need to be that thin on nRESET. Fix silkscreen refdeses on new components. Move pin 1 marker on the BP0805A1308. Remove thermals on PA bottom layer. Added oresat-c3-eagle-import symbols and footprints so everything is local.
42 lines
3.4 KiB
Plaintext
42 lines
3.4 KiB
Plaintext
(footprint "TDFN-8" (version 20211014) (generator pcbnew)
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(layer "F.Cu")
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(tedit 0)
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(fp_text reference "REF**" (at -1.03 3.31) (layer "F.SilkS")
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(effects (font (size 0.508 0.508) (thickness 0.127)) (justify left bottom))
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(tstamp be387e80-ed89-43f0-9415-cc58463e21a1)
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)
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(fp_text value "" (at 0 0) (layer "F.Fab")
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(effects (font (size 1.27 1.27) (thickness 0.15)))
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(tstamp 91c0c55a-9a40-4e2b-b701-79f376e025da)
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)
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(fp_line (start -2.1844 2.4384) (end 2.1844 2.4384) (layer "F.SilkS") (width 0.1524) (tstamp 3610c5cb-1363-4b64-9068-726c19d01f21))
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(fp_line (start 2.1844 -1.9558) (end 2.1844 -2.4384) (layer "F.SilkS") (width 0.1524) (tstamp 3cd5ea58-25b0-45f1-8327-2f55c40bc00f))
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(fp_line (start -2.1844 -2.4384) (end -2.1844 -1.9558) (layer "F.SilkS") (width 0.1524) (tstamp 6c854ce1-6362-4fe6-975c-e292f3333e0a))
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(fp_line (start 2.1844 -2.4384) (end -2.1844 -2.4384) (layer "F.SilkS") (width 0.1524) (tstamp 977f77b9-764b-4a85-a708-b7b253210ee8))
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(fp_line (start 2.1844 2.4384) (end 2.1844 1.9558) (layer "F.SilkS") (width 0.1524) (tstamp a6ccd9bc-79ce-4edf-a371-717656863d5a))
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(fp_line (start -2.1844 1.9558) (end -2.1844 2.4384) (layer "F.SilkS") (width 0.1524) (tstamp d7b1a666-7605-43ea-86a2-55c49fb11bfa))
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(fp_circle (center -2.9 -1.4) (end -2.61716 -1.4) (layer "F.SilkS") (width 0.127) (fill none) (tstamp 720fa446-819b-427a-8a6b-96bf438ffe98))
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(fp_line (start 2.032 -2.286) (end -2.032 -2.286) (layer "F.Fab") (width 0.1524) (tstamp 65db4e1c-47d8-4da4-ae6e-21a800351069))
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(fp_line (start -2.032 -2.286) (end -2.032 2.286) (layer "F.Fab") (width 0.1524) (tstamp b40e46a7-2f9e-4806-a75f-0a7bb3ad1f56))
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(fp_line (start 2.032 2.286) (end 2.032 -2.286) (layer "F.Fab") (width 0.1524) (tstamp f16085fe-671d-4553-9fad-51b4c8e5a5f1))
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(fp_line (start -2.032 2.286) (end 2.032 2.286) (layer "F.Fab") (width 0.1524) (tstamp fda3d25d-1e9e-4d58-954f-2934a7c5611f))
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(pad "1" smd rect (at -1.9915 -1.424996) (size 0.7064 0.4072) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp dc1018d6-ebb6-4c5a-afa8-50ea8dc71bfa))
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(pad "2" smd rect (at -1.9915 -0.475) (size 0.7064 0.4072) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 3db3fdd6-f844-41f7-b770-bb9bc1ddcb7f))
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(pad "3" smd rect (at -1.9915 0.475) (size 0.7064 0.4072) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp df4f2e84-7e4a-4d95-b08c-5b91557168ce))
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(pad "4" smd rect (at -1.9915 1.425) (size 0.7064 0.4072) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 079ad9de-7882-49e6-b7a0-c4133894e21a))
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(pad "5" smd rect (at 1.9915 1.424996) (size 0.7064 0.4072) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 33974237-7d34-4584-83ef-d9f170d92df8))
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(pad "6" smd rect (at 1.9915 0.475) (size 0.7064 0.4072) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 42942a98-6572-47c3-b5bf-e423e0239b4f))
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(pad "7" smd rect (at 1.9915 -0.475) (size 0.7064 0.4072) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp b04fb17b-3e97-41cf-a594-016098a2c5d2))
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(pad "8" smd rect (at 1.9915 -1.425) (size 0.7064 0.4072) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0635) (tstamp 154d0379-fa69-4285-9cbd-ca548aec3bf5))
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(pad "9" smd rect (at 0 0) (size 2.6924 3.7084) (layers "F.Cu")
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(solder_mask_margin 0.0635) (tstamp bccaca52-dab9-4d3e-9bc8-88be83ab5223))
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)
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