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mirror of https://github.com/oresat/oresat-cfc-hardware.git synced 2026-02-03 11:47:43 +00:00
Scott Dixon a1888808e4 Initial conversion of cfc processor board from Eagle to KiCAD 9
Still using converted Eagle symbols and footprints.
2025-06-12 14:41:06 -07:00

144 lines
2.7 KiB
Plaintext

(footprint "C70(TI-DCK)"
(version 20241229)
(generator "pcbnew")
(generator_version "9.0")
(layer "F.Cu")
(property "Reference" "REF**"
(at -1.143 -3.429 0)
(unlocked yes)
(layer "F.SilkS")
(uuid "247542b1-67ce-49cb-8189-9980d771ae1c")
(effects
(font
(size 0.508 0.508)
(thickness 0.127)
)
(justify left bottom)
)
)
(property "Value" "C70(TI-DCK)"
(at -1.27 -2.54 0)
(unlocked yes)
(layer "F.Fab")
(uuid "630f6404-9b88-44f5-9c59-c4cd17ad18f9")
(effects
(font
(size 0.508 0.508)
(thickness 0.127)
)
(justify left bottom)
)
)
(property "Datasheet" ""
(at 0 0 0)
(layer "F.Fab")
(hide yes)
(uuid "0b54f7e4-836a-4156-921d-e91154c69dcf")
(effects
(font
(size 1.27 1.27)
(thickness 0.15)
)
)
)
(property "Description" ""
(at 0 0 0)
(layer "F.Fab")
(hide yes)
(uuid "b77c298d-161e-46b8-b37f-3d2d43095a39")
(effects
(font
(size 1.27 1.27)
(thickness 0.15)
)
)
)
(fp_line
(start -1 -0.5)
(end -1 0.625)
(stroke
(width 0.127)
(type solid)
)
(layer "F.SilkS")
(uuid "06ceda30-9a5c-43a6-b5ef-991f5094c3fd")
)
(fp_line
(start -0.28 0.625)
(end 0.28 0.625)
(stroke
(width 0.127)
(type solid)
)
(layer "F.SilkS")
(uuid "1a0a4fcb-53d8-40e8-9c46-5e33aa3dbcd8")
)
(fp_line
(start 1 -0.5)
(end 1 0.5)
(stroke
(width 0.127)
(type solid)
)
(layer "F.SilkS")
(uuid "4d277738-57d6-43f1-8bba-57fe73643dac")
)
(fp_circle
(center 1.27 -1.143)
(end 1.397 -1.143)
(stroke
(width 0.254)
(type solid)
)
(fill no)
(layer "F.SilkS")
(uuid "7dd1e504-a839-4f69-b360-d72f478a59fd")
)
(pad "1" smd rect
(at 0.65 -1.1)
(size 0.4 0.9)
(layers "F.Cu" "F.Mask" "F.Paste")
(solder_mask_margin 0.0635)
(solder_paste_margin 0)
(thermal_bridge_angle 0)
(uuid "898796bd-2b21-4715-bb4b-1bc9dad61ba2")
)
(pad "2" smd rect
(at 0 -1.1)
(size 0.4 0.9)
(layers "F.Cu" "F.Mask" "F.Paste")
(solder_mask_margin 0.0635)
(solder_paste_margin 0)
(thermal_bridge_angle 0)
(uuid "2c8daa7c-37ee-49b6-8f24-b61b39c55c76")
)
(pad "3" smd rect
(at -0.65 -1.1)
(size 0.4 0.9)
(layers "F.Cu" "F.Mask" "F.Paste")
(solder_mask_margin 0.0635)
(solder_paste_margin 0)
(thermal_bridge_angle 0)
(uuid "17598ed2-cbed-43ba-8e33-41a7cced18c3")
)
(pad "4" smd rect
(at -0.65 1.1)
(size 0.4 0.9)
(layers "F.Cu" "F.Mask" "F.Paste")
(solder_mask_margin 0.0635)
(solder_paste_margin 0)
(thermal_bridge_angle 0)
(uuid "910172b1-7cab-4748-b9d2-09455925dfa2")
)
(pad "5" smd rect
(at 0.65 1.1)
(size 0.4 0.9)
(layers "F.Cu" "F.Mask" "F.Paste")
(solder_mask_margin 0.0635)
(solder_paste_margin 0)
(thermal_bridge_angle 0)
(uuid "4d6c3884-e913-4f5d-87ba-9764f1c934c3")
)
(embedded_fonts no)
)