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mirror of https://github.com/oresat/oresat-cfc-hardware.git synced 2026-02-18 13:13:13 +00:00
Scott Dixon a1888808e4 Initial conversion of cfc processor board from Eagle to KiCAD 9
Still using converted Eagle symbols and footprints.
2025-06-12 14:41:06 -07:00

65 lines
1.3 KiB
Plaintext

(footprint "PAD.03X.04"
(version 20241229)
(generator "pcbnew")
(generator_version "9.0")
(layer "F.Cu")
(descr "Electrically Conductive Pad 0.04\" Circle Used as a test point connection for pogo pins or other debugging tools.\n\nSpecifications:\n• Area: 0.04\" x 0.04\"\n\nExample device(s):\n\n• TEST_POINT")
(property "Reference" "REF**"
(at 0 0 0)
(layer "F.SilkS")
(uuid "3a1a176a-bf2a-464c-b833-b691e0148d0b")
(effects
(font
(size 1.27 1.27)
(thickness 0.15)
)
)
)
(property "Value" ""
(at 0 0 0)
(layer "F.Fab")
(uuid "b7ee9a03-d2f5-42eb-a991-28371ae79df3")
(effects
(font
(size 1.27 1.27)
(thickness 0.15)
)
)
)
(property "Datasheet" ""
(at 0 0 0)
(layer "F.Fab")
(hide yes)
(uuid "897db81e-c637-4595-ac77-913eb4698010")
(effects
(font
(size 1.27 1.27)
(thickness 0.15)
)
)
)
(property "Description" ""
(at 0 0 0)
(layer "F.Fab")
(hide yes)
(uuid "9f2c88fc-430c-4a47-8db5-d3dbf81af2da")
(effects
(font
(size 1.27 1.27)
(thickness 0.15)
)
)
)
(pad "P$1" smd roundrect
(at 0 0)
(size 1.016 1.016)
(layers "F.Cu" "F.Mask")
(roundrect_rratio 0.5)
(solder_mask_margin 0.0635)
(solder_paste_margin 0)
(thermal_bridge_angle 0)
(uuid "d10e3459-0030-4b0e-966e-cf271f7f0de4")
)
(embedded_fonts no)
)