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mirror of https://github.com/oresat/oresat-cfc-hardware.git synced 2026-02-14 04:43:19 +00:00
Scott Dixon a1888808e4 Initial conversion of cfc processor board from Eagle to KiCAD 9
Still using converted Eagle symbols and footprints.
2025-06-12 14:41:06 -07:00

126 lines
2.3 KiB
Plaintext

(footprint "SOT23-BEC"
(version 20241229)
(generator "pcbnew")
(generator_version "9.0")
(layer "F.Cu")
(descr "TO-236 ITT Intermetall")
(property "Reference" "REF**"
(at -1.27 -3.429 0)
(unlocked yes)
(layer "F.SilkS")
(uuid "9265c01c-0fb8-4d0a-a2e4-c1c481839e13")
(effects
(font
(size 0.508 0.508)
(thickness 0.127)
)
(justify left bottom)
)
)
(property "Value" "SOT23-BEC"
(at -1.27 -2.54 0)
(unlocked yes)
(layer "F.Fab")
(uuid "da39b961-2f4c-448d-8282-7ed0b329e18a")
(effects
(font
(size 0.508 0.508)
(thickness 0.127)
)
(justify left bottom)
)
)
(property "Datasheet" ""
(at 0 0 0)
(layer "F.Fab")
(hide yes)
(uuid "1da349ea-c92e-4b3b-8790-bf32dc1ee9c5")
(effects
(font
(size 1.27 1.27)
(thickness 0.15)
)
)
)
(property "Description" ""
(at 0 0 0)
(layer "F.Fab")
(hide yes)
(uuid "63b5cec8-1eed-4642-9e00-2d83ff601c4a")
(effects
(font
(size 1.27 1.27)
(thickness 0.15)
)
)
)
(fp_line
(start -1.4 -0.7)
(end -1.4 0.1)
(stroke
(width 0.2032)
(type solid)
)
(layer "F.SilkS")
(uuid "24db186a-9a6c-4b19-a84b-68de499272eb")
)
(fp_line
(start -0.8 -0.7)
(end -1.4 -0.7)
(stroke
(width 0.2032)
(type solid)
)
(layer "F.SilkS")
(uuid "54664614-4c65-4517-a286-87c7bc01a30f")
)
(fp_line
(start 0.8 -0.7)
(end 1.4 -0.7)
(stroke
(width 0.2032)
(type solid)
)
(layer "F.SilkS")
(uuid "2c599559-cb47-4461-8a1c-648c1ed11cf5")
)
(fp_line
(start 1.4 -0.7)
(end 1.4 0.1)
(stroke
(width 0.2032)
(type solid)
)
(layer "F.SilkS")
(uuid "35ccf604-adf1-4a70-8967-15839c4ba480")
)
(pad "B" smd rect
(at -0.95 1.1)
(size 1 1.4)
(layers "F.Cu" "F.Mask" "F.Paste")
(solder_mask_margin 0.0635)
(solder_paste_margin 0)
(thermal_bridge_angle 0)
(uuid "eba06877-7646-45d5-89ae-ed743805b024")
)
(pad "C" smd rect
(at 0 -1.1)
(size 1 1.4)
(layers "F.Cu" "F.Mask" "F.Paste")
(solder_mask_margin 0.0635)
(solder_paste_margin 0)
(thermal_bridge_angle 0)
(uuid "c865ab7a-96ff-40fe-8c28-4a5e044ab61b")
)
(pad "E" smd rect
(at 0.95 1.1)
(size 1 1.4)
(layers "F.Cu" "F.Mask" "F.Paste")
(solder_mask_margin 0.0635)
(solder_paste_margin 0)
(thermal_bridge_angle 0)
(uuid "8a783870-43e4-4eee-85ca-c3266748c091")
)
(embedded_fonts no)
)