mirror of
https://github.com/oresat/oresat-c3-hardware.git
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202 lines
8.2 KiB
Markdown
202 lines
8.2 KiB
Markdown
---
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title: "**OreSat C3 Card**"
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subtitle: |
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**Fabrication and Assembly Information**\
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For build TIME-STAMP
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fontsize: 10pt
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geometry:
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- margin=0.5in
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toc: true
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toc-depth: 2
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colorlinks: true
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urlcolor: blue
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---
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\newpage
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# About this Board
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## Board Description
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The C3 ("Command, Control, and Communications") card is the main on-board computer (OBC) / housekeeping unit (HKU) / Command and Data Handling (CDH) subsystem for the open source [OreSat CubeSat system](https://www.oresat.org/). The C3 card:
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- Connects to the backplane with a main connector and two RF ports
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- Has an L band radio receiver based on the AT86RF215.
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- Has a UHF radio transceiver based on the AT86RF215
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- Has a radiation tolerant watchdog timer (with a cheap commercial replacement if you're not going to orbit)
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- Controls the OreSat Power Domain (OPD), which turns on and off and controls other cards
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- Talks to both CAN OreSat CAN busses
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## Documentation Links
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- C3 hardware Git repository: <https://github.com/oresat/oresat-c3-hardware>
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- C3 software Git reposity: <https://github.com/oresat/oresat-c3-software>
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- **TODO:** C3 Design Notes + Design Review Notes
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## Documentation Files
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| Filename | Notes |
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| ------------------------------- | ---------------------------------------- |
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| README.pdf | This README file |
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| PROJECT-NAME-outline.dxf | Board outline (with holes) in DXF format |
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| PROJECT-NAME-pcba.step | 3D model of PCBA (with components) |
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| PROJECT-NAME-render-bot.jpg | Render of the top of the 3D model |
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| PROJECT-NAME-render-bot.jpg | Render of the bottom of the 3D model |
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| PROJECT-NAME-schematic.pdf | PDF of board schematics |
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## Contact Information
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- Website: <https://www.oresat.org/>
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- Email: <oresat@pdx.edu>
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- Instagram: @pdxaerospace
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## Board Renders
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{width=50%}
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{width=50%}
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\newpage
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# Printed Circuit Board (PCB) Fabrication Information
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## Board Info
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- 4 layer board
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- Bounding box is 99.8 x 94.6 mm (3.93 x 3.72 in)
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- Board thickness is 1.59 mm (0.063 inch)
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- **Important:** See Materials and Stack Up sections below
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## Board Requirements
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- Design Rules
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- Minimum Trace / Space design rules
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- Outer layers: 0.127 mm (5.0 mil) / 0.127 mm (5.0 mil)
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- Inner layers: 0.127 mm (5.0 mil) / 0.127 mm (5.0 mil)
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- Outer dimension router tolerance: +/- 0.254 mm (10.0 mil)
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- Hole placement tolerance: +/- 0.075 mm (3.0 mil)
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- Inner tab routed slot tolerance: +/- 0.254 mm (10.0 mil)
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- Drills
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- Drill Positional Tolerance: 0.051 mm (2.0 mil)
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- Drill Size tolerance: +/- 0.064 mm (2.5 mil)
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- Plated/Un-plated holes
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- There are 6 un-plated (NPT) holes
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- There are 1477 plated through (PTH) holes
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- PTH minimum diameter: 0.254 mm (10 mil)
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- PTH minimum annulus: 0.102 mm (4 mil) radius
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- Outline/Routing
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- Requires a 1.0 mm or smaller diameter routing bit
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- Slots
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- There are no slots.
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- Cutouts
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- There are no cutouts
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- There are 3 fiducials on the top layer.
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- Panel tabs ("mouse bites")
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- Card edges must be smooth; no mouse bites or other intrusions into the card outline.
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- If external mouse bites are required, minimize and customer will remove by hand before assembly.
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- If not otherwise specified, build to IPC 6012 Class 2 or better.
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## Materials
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- Controlled impedance
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- The stackup is critical for the performance of high speed signals on this board.
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- As long as the stackup is controlled, the board is not considered controlled impedance.
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- Isola FR408HR or material with equivalent Dk.
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- Board Surface treatment should be ENIG, althogh immersion Silver is acceptable.
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- White silkscreen on top and bottom surface
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- Taiyo PSR-4000 or equivalent soldermask on top and bottom, no requirements for color.
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## Stack Up
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| Layer | Thickness | Notes |
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|---------------|---------------------|----------------------------------------------|
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| Top Copper | 0.043 mm / 1.7 mil | Layer 1 foil, 1 oz Cu after plating |
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| prepreg | 0.200 mm / 7.9 mil | Prepreg - Isola FR408HR 2113 |
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| Layer 2 | 0.018 mm / 0.7 mil | Layer 2 foil, 0.5 oz Cu |
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| Core | 0.991 mm / 39 mil | Core Isola FR408HR |
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| Layer 3 | 0.018 mm / 0.7 mil | Layer 3 foil, 0.5 oz Cu |
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| prepreg | 0.200 mm / 7.9 mil | Prepreg - Isola FR408HR 2113 |
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| Bottom Copper | 0.043 mm / 1.7 mil | Layer 4 foil, 1 oz copper after plating |
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| **Total Stackup** | **1.588 mm / 62.5 mil** | |
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## Array / Panel Information
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- Coordinate with Contract Manufacturer (CM) for optimal size of this panel.
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- If no feedback from CM, then produce single boards (no panel).
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## Fabrication Files
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### IPC-2581 File
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| Filename | Notes |
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| ------------------------ | --------------------------------------- |
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| PROJECT-NAME-ipc2581.xml | IPC-2581 board information file |
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### Legacy PCB Files
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| Filename | Notes |
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| ------------------------------| --------------------------------------------- |
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| PROJECT-NAME-Edge_Cuts.gbr | RS274X file for the dimension (outline) layer |
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| PROJECT-NAME-F_Silkscreen.gbr | RS274X file for the top silkscreen |
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| PROJECT-NAME-F_Mask.gbr | RS274X file for the top soldermask |
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| PROJECT-NAME-F_Cu.gbr | RS274X file for the top copper layer |
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| PROJECT-NAME-In1_Cu.gbr | RS274X file for the layer 2 copper |
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| PROJECT-NAME-In2_Cu.gbr | RS274X file for the layer 3 copper |
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| PROJECT-NAME-B_Cu.gbr | RS274X file for the bottom copper layer |
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| PROJECT-NAME-B_Mask.gbr | RS274X file for the bottom soldermask |
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| PROJECT-NAME-B_Silkscreen.gbr | RS274X file for the bottom silkscreen |
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| PROJECT-NAME-NPTH.drl | Excellon file for non-plated through holes |
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| PROJECT-NAME-PTH.drl | Excellon file for plated through holes |
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\newpage
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# Printed Circuit Board Assembly (PCBA) Information
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## Assembly Info
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- All components are on the top side of the board.
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- This PCBA is mostly surface mount (SMT) with a few (THT) components.
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## Assembly Requirements
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- Assemble to IPC Class 2 or better
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- Bake components that are not moisture sealed to appropriate levels as required.
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- Solder paste MUST be leaded.
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- Aqueous flux and wash strongly preferred.
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- Clean to NASA Standard "Visibly Clean (VC)": No particles or residues are visible to the naked eye.
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- No conformal coating.
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- Ship in antistatic protective bag
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## Component Specific Assembly Information
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- SMPM connectors (J3, J4) should be hand-added (there is no solder paste for their footprints).
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- U1 and U28 are extremely expensive ($75 and $150 ea, respectively).
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- U15 and U21 are EOL and will be supplied in cut tape form.
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## Assembly Files
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### IPC-2581 File
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| Filename | Notes |
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| ------------------------ | ------------------------------- |
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| PROJECT-NAME-ipc2581.xml | IPC-2581 board information file |
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### Bill of Materials (BOM)
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| Filename | Description |
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| -------------------- | -------------------------------------- |
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| PROJECT-NAME-bom.csv | BOM in Comma Separated Variable format |
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### Solder Paste Stencils
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| Filename | Notes |
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| ------------------------ | ------------------------------------------------ |
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| PROJECT-NAME-B_Paste.gbr | RS274X file for top/front solder paste stencil |
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| PROJECT-NAME-F_Paste.gbr | RS274X file for bottom/back solder paste stencil |
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### Mounting/Placement Location
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| Filename | Description |
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| ------------------- | ------------------------------------------- |
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| PROJECT-NAME-3u.pos | Pick and place locations for components |
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